1
David Mosley Garo Khanarian
Garo Khanarian, David Wayne Mosley: Light emitting device having improved light extraction efficiency and method of making same. Rohm and Haas Company, Jonathan D Baskin, April 21, 2009: US07521727 (17 worldwide citation)

A light emitting device including a multi-layer stack and an encapsulant layer having a patterned encapsulant region in optical proximity to a luminous stack surface of the multi-layer stack is disclosed. A method of making that encapsulant layer and of affixing that encapsulant layer to a luminous ...


2
Shankar M V
Ramachandran Gopi Chandran, Madras Venugopal Shankar, Venkatraman Sivaramakrishan, Hari Nadathur Seshadri: Borate phosphor materials for use in lighting applications. Lumination, Fay Sharpe, September 25, 2007: US07274045 (58 worldwide citation)

Boron containing phosphor compositions having the formulas (1) M3Ln2(BO3)4 doped with at least one activator selected from the group of Eu2+, Mn2+, Pb2+, Ce3+, Eu3+, Tb3+, and Bi3+ where M is at least one of Mg, Ca, Sr, Ba, or Zn, and Ln is at least one of Sc, Y, La, Gd, or Lu; (2) M2−xM′x(Al, Ga)2− ...


3
David Sherrer
David W Sherrer, Mindaugus F Dautargas, Neil Ricks, Dan A Steinberg: Wafer level packaging for optoelectronic devices. Shipley Company L L C, Jonathan D Baskin, March 18, 2008: US07345316 (10 worldwide citation)

An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a li ...


4
Garo Khanarian
Garo Khanarian: Patterned light extraction sheet and method of making same. Rohm and Haas Electronic Materials, Jonathan D Baskin, June 7, 2011: US07955531 (6 worldwide citation)

A light extraction encapsulant sheet having a patterned encapsulant region is disclosed. A method of making that light extraction encapsulant sheet and of affixing that light extraction encapsulant sheet to a luminous stack surface of a multi-layer stack is also disclosed.


5
Shankar M V
Dan Hancu, Mukunda Adyam, Emil Radkov, Prasanth Kumar, Anant Achyut Setlur, Alok Mani Srivastava, Holly Ann Comanzo, Gopi Chandran, Madras Venugopal Shankar: Phosphor and blends thereof for use in LEDs. Lumination, Fay Sharpe, March 10, 2009: US07501753 (4 worldwide citation)

Phosphor compositions having the formula EueMmAaGgQqNnXx, where M is at least one of Be, Mg, Ca, Sr, Ba, Cd, Sn, Pb or Zn; A is at least one of B, Al, Ga, In, Bi, Sc, Y, La or a rare earth element other than Eu; G is at least one of Si or Ge; Q is at least one of O, S, and Se; X is at least one of F ...


6
David Sherrer
David W Sherrer, Mindaugas F Dautartas, Neil Ricks, Dan A Steinberg: Optical device package. Samsung Electronics, Sughrue Mion PLLC, March 19, 2013: US08399897 (1 worldwide citation)

An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a li ...


7
Garo Khanarian
Garo Khanarian: Light emitting device having improved light extraction efficiency and method of making same. Rohm And Haas Company, December 13, 2007: US20070284601-A1

A light emitting device including a multi-layer stack and an encapsulant layer having a patterned encapsulant region in optical proximity to a luminous stack surface of the multi-layer stack is disclosed. A method of making that encapsulant layer and of affixing that encapsulant layer to a luminous ...


8
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and method for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Edwards & Angell, May 26, 2005: US20050110157-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


9
David Sherrer
David W Sherrer, Mindaugus F Dautargas, Neal Ricks, Dan A Steinberg: Wafer level packaging for optoelectronic devices. Maria M Eliseeva, Brown Rudnick Berlack Israels, December 30, 2004: US20040264866-A1

An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a li ...


10
David Sherrer
Dan A Steinberg, David W Sherrer: Submount having transmission line and method for forming. Haleos, May 16, 2002: US20020056849-A1

A submount and a method for making the submount, is described. A substrate has a channel formed therein. An insulator material, such as a dielectric material, is deposited on the substrate within the channel and on an upper surface of the substrate. A conductive material is deposited over the dielec ...