1
Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Michael Estrella, Jae M Park, Kenneth Robert Thompson, Craig S Mitchell, Belgacem Haba: Image sensor package and fabrication method. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 6, 2008: US07368695 (23 worldwide citation)

An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent ...


2
Ivo Koutsaroff 掘露 伊保龍
Koutsaroff Ivoyl P, Vandermeulen Mark, Cervin Lawry Andrew, Patel Atin J: Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same. Gennum, September 6, 2006: EP1697991-A1

In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, ...


3
Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Michael Estrella, Jae M Park, Kenneth Robert Thompson, Craig S Mitchell, Belgacem Haba: Image sensor package and fabrication method. Tessera, LERNER DAVID et al, Tessera, December 22, 2005: US20050279916-A1

An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent ...


4
Ivo Koutsaroff 掘露 伊保龍
Koutsaroff Ivoyl P, Vandermeulen Mark, Cervin Lawry Andrew, Patel Atin J: Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same. Gennum Corporation, Koutsaroff Ivoyl P, Vandermeulen Mark, Cervin Lawry Andrew, Patel Atin J, PERRY Stephen J, June 9, 2005: WO/2005/053026

In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, ...


5
Jon H Bechtel, Joseph S Stam: Control circuit for image array sensors. Gentex Corporation, Brooks & Kushman P C, November 23, 1999: US05990469 (497 worldwide citation)

A control system for controlling an image array sensor and controlling communication between the image array sensor and a microcontroller by way of a serial communication interface. The control system is able to efficiently control various aspects of the image array sensor such as windowing, mode of ...


6
Brent J Bos, Kenneth Schofield, Mark L Larson, Niall R Lynam: Interior rearview mirror system including a forward facing video device. Donnelly Corporation, Van Dyke Gardner Linn & Burkhart, October 19, 2004: US06806452 (346 worldwide citation)

An interior rearview mirror system suitable for use in a vehicle includes a interior rearview mirror assembly adapted for attachment to an interior portion of the vehicle. The interior rearview mirror assembly includes a housing and a reflective element included within the housing. The mirror system ...


7
Michinori Ichikawa, Takanori Tanite, Tadashi Kawata: Solid-state image sensor. Brainvision, Stanley Electric, Birch Stewart Kolasch & Birch, March 23, 2010: US07683954 (333 worldwide citation)

A solid-state image sensor of a charge sorting method used in a time-of-flight measurement method, in which noise derived from background light, which is caused by the reflection light from the subject derived from background light is eliminated, reflection light from the subject derived from a pred ...


8
John C Carson, Raphael R Some: Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stack. Irvine Sensors Corporation, Thomas J Plante, July 11, 1995: US05432729 (269 worldwide citation)

An electronic module comprising a multiplicity of prestacked IC chips, such as memory chips, and an IC chip, referred to as an active substrate or active backplane, to which the stack of chips is directly secured. A multiplicity of aligned solder bumps may interconnect the stack and the substrate, p ...


9
Joseph S Stam, Mark W Pierce, Harold C Ockerse: Image processing system to control vehicle headlamps or other vehicle equipment. Gentex Corporation, Price Heneveld Cooper Dewitt & Litton, James E Shultz Jr, December 12, 2006: US07149613 (258 worldwide citation)

An imaging system of the invention includes an image array sensor including a plurality of pixels. Each of the pixels generates a signal indicative of the amount of light received on the pixel. The imaging system further includes an analog to digital converter for quantizing the signals from the pix ...


10
Haruo Wakai, Nobuyuki Yamamura, Syunichi Sato, Minoru Kanbara: Thin film transistor array. Casio Computer, Frishauf Holtz Goodman & Woodward, March 26, 1991: US05003356 (243 worldwide citation)

A TFT array having a plurality of gate lines and a plurality of drain lines formed on a transparent substrate. The gate lines intersect with the drain lines. TFT are formed at the intersections of the gate lines and the drain lines. An insulating film is formed on the drain lines and the drain elect ...