1
Segaud Daniel: Supporting structure, especially for signalling lights of motor vehicles, and its manufacturing process.. Valeo Vision, March 10, 1993: EP0531185-A1 (86 worldwide citation)

The supporting structure equipped with an electronic circuit with multiple components, especially for signalling lights (indicators) of motor vehicles, comprises strips (42) separated from each other by slits (43), a plurality of the said multiple components (3) being mounted on each of the said str ...


2
Hidehiko Akasaki, Takehisa Tsujimura: Semiconductor device including leadless packages and a base plate for mounting the leadless packages. Fujitsu, Staas & Halsey, July 21, 1987: US04682207 (59 worldwide citation)

A semiconductor device includes a plurality of leadless packages and a base plate for mounting the leadless packages. The leadless packages include a semiconductor chip housed therein and a plurality of electrodes formed on the surface thereof. The base plate has conductor patterns formed on both of ...


3
Richard Francis Frankeny, Jerome Albert Frankeny, Danny Edward Massey, Keith Allan Vanderlee: Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer. International Business Machines Corporation, Casimer K Salys, June 23, 1998: US05770891 (52 worldwide citation)

A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid ...


4
Robert J Weber: Compact reduced parasitic resonant frequency pulsed power source at microwave frequencies. Rockwell International Corporation, Gregory G Williams, M Lee Murrah, H Fredrick Hamann, January 23, 1990: US04896205 (51 worldwide citation)

A Compact Reduced Parasitic Resonant Frequency Pulsed Power Source at Microwave Frequencies is disclosed which uses a series of stacked IMPATT diodes with thick metallic heat sinks interposed between each of the IMPATT diodes with the effective heat sink of each heat sink being roughly equivalent to ...


5
Takashi Oyamada: Structure for connecting leadless chip carrier. NEC Corporation, Ostrolenk Faber Gerb & Soffen, September 8, 1987: US04692790 (51 worldwide citation)

A structure for accurately connecting a connection pattern on a leadless chip carrier (LCC) to a connection pattern on a receiving surface by means of a connector, i.e., without resorting to solder. The structure includes a generally frame- or box-shaped support cover in which the LCC is received. T ...


6
King L Tai, John Thomson Jr: Integrated circuit package and compact assemblies thereof. AT&T Bell Laboratories, Glenn E Books, August 27, 1991: US05043794 (47 worldwide citation)

In accordance with the present invention, an integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conduct ...


7
Patrick F Thompson: Integrated circuit assembly having a stepped interposer and method. Motorola, Rennie William Dover, February 3, 1998: US05714800 (46 worldwide citation)

A method of forming an integrated circuit assembly having a stepped interposer (300), an integrated circuit die (200) and an encapsulant (500). The stepped interposer (300) includes a central portion (320) having a plurality of contact regions (360), and a peripheral region (330), completely surroun ...


8
Seietsu Tanaka, Tomiichi Shibata: Method for manufacturing IC plastic package with window. Oki Electric, Wenderoth Lind & Ponack, May 12, 1987: US04663833 (46 worldwide citation)

A method for manufacturing a plastic IC package with a light receiving window, for a semiconductor IC device, which includes the steps of preparing a lead frame supporting member provided, in a central portion of a main surface thereof, with a groove for receiving a liquid molding resin therein, dis ...


9
Grellman H Erwin, Reagan John J, Roland Leonard A, Laakso Carl W: Coplanar microstrap waveguide.. Tektronix, September 24, 1986: EP0195520-A1 (43 worldwide citation)

An electrical connection between two semiconductor devices employs a coplanar microstrap waveguide comprising a plurality of thin straps of conductive metal embedded in a polyimide substrate and dimensioned to exhibit the properties of a coplanar waveguide. The waveguide structure provides the prope ...


10
Daniel J Miller, Kim H Chen, Lewis R Dove, Vaddoarahalli K Nagesh: Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects. Hewlett Packard Company, Patrick J Murphy, June 20, 1995: US05426405 (39 worldwide citation)

A family of modular hybrid assemblies with high frequency interconnections is effected by a high frequency circuit assembly attached to a motherboard. Each assembly comprises standardized conducting elements and customizable transitions and circuit regions. The customizable transitions can be placed ...