1
Belgacem Haba Belgacem (Bel) Haba
Young Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assembly and method therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 1, 2001: US06225688 (250 worldwide citation)

A stacked microelectronic assembly and its resulting structure includes a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The assembly includes a plurality of microelectronic ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 10, 2012: US08093697 (79 worldwide citation)

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Masud Beroz: Stacked packaging improvements. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 3, 2013: US08525314 (55 worldwide citation)

A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 2, 2011: US07989940 (55 worldwide citation)

A multi-layer electronic package having polymeric tape layers, where at least one of the polymeric tape layers has a via, through hole, or aperture therein to pass wiring between the layers. This enables a balance of package size, adhesive thickness, chip access, inventory management, package width, ...


5
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with orthogonal windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, August 28, 2012: US08254155 (47 worldwide citation)

A microelectronic assembly can include first and second microelectronic packages mounted to opposed surfaces of a circuit panel. Each package can include a substrate having first, second, and third apertures extending therethrough, first, second, and third microelectronic elements each having a surf ...


6
Belgacem Haba Belgacem (Bel) Haba
Bruce M McWilliams, Giles Humpston, Belgacem Haba, David B Tuckerman: Structure and method of making sealed capped chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 20, 2007: US07298030 (46 worldwide citation)

A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from ...


7
Belgacem Haba Belgacem (Bel) Haba
Kishor Desai, Belgacem Haba, Wael Zohni: Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 19, 2013: US08378478 (43 worldwide citation)

The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelec ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Vage Oganesian: Edge connect wafer level stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 20, 2011: US08022527 (37 worldwide citation)

In accordance with an aspect of the invention, a stacked microelectronic package is provided which may include a plurality of subassemblies, e.g., a first subassembly and a second subassembly underlying the first subassembly. A front face of the second subassembly may confront the rear face of the f ...


9
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659142 (29 worldwide citation)

A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to the panel contacts at the first and second surfaces, respectively. The circuit panel can electrically ...


10
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of terminals for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, February 25, 2014: US08659141 (29 worldwide citation)

A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the f ...