1
Anchuan Wang, Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen, Ching Mei Hsu, Jiayin Huang, Nitin K Ingle, Dmitry Lubomirsky, Shankar Venkataraman, Randhir Thakur: Processing systems and methods for halide scavenging. Applied Materials, Kilpatrick Townsend & Stockton, July 28, 2015: US09093371 (85 worldwide citation)

Systems, chambers, and processes are provided for controlling process defects caused by moisture contamination. The systems may provide configurations for chambers to perform multiple operations in a vacuum or controlled environment. The chambers may include configurations to provide additional proc ...


2
Anchuan Wang, Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen, Ching Mei Hsu, Jiayin Huang, Nitin K Ingle, Dmitry Lubomirsky, Shankar Venkataraman, Randhir Thakur: Processing systems and methods for halide scavenging. Applied Materials, Kilpatrick Townsend & Stockton, May 5, 2015: US09023732 (85 worldwide citation)

Systems, chambers, and processes are provided for controlling process defects caused by moisture contamination. The systems may provide configurations for chambers to perform multiple operations in a vacuum or controlled environment. The chambers may include configurations to provide additional proc ...


3
Anchuan Wang, Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen, Ching Mei Hsu, Jiayin Huang, Nitin K Ingle, Dmitry Lubomirsky, Shankar Venkataraman, Randhir Thakur: Processing systems and methods for halide scavenging. Applied Materials, Kilpatrick Townsend & Stockton, October 6, 2015: US09153442 (84 worldwide citation)

Systems, chambers, and processes are provided for controlling process defects caused by moisture contamination. The systems may provide configurations for chambers to perform multiple operations in a vacuum or controlled environment. The chambers may include configurations to provide additional proc ...


4
Hassan Javathu K, Mack Alfred, Wojtaszek Michael R: Method and apparatus for handling workpieces. International Business Machines Corporation, Leach Jr Frank C, Galanthay Theodore E, April 1, 1975: US3874525 (83 worldwide citation)

A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elev ...


5
Anchuan Wang, Xinglong Chen, Zihui Li, Hiroshi Hamana, Zhijun Chen, Ching Mei Hsu, Jiayin Huang, Nitin K Ingle, Dmitry Lubomirsky, Shankar Venkataraman, Randhir Thakur: Processing systems and methods for halide scavenging. Applied Materials, Kilpatrick Townsend & Stockton, November 10, 2015: US09184055 (82 worldwide citation)

Systems, chambers, and processes are provided for controlling process defects caused by moisture contamination. The systems may provide configurations for chambers to perform multiple operations in a vacuum or controlled environment. The chambers may include configurations to provide additional proc ...


6
Tepman Avi, Todd Craig B, Yu James Enhao, Kim Daehwan Daniel, Buchner Chris, Kumar Shiv: Substrate processing system and method. Applied Materials, June 13, 2001: EP1107288-A2 (81 worldwide citation)

The present invention generally provides a modular vacuum processing system which includes a mainframe supporting a transfer chamber, one or more load locks and process chambers mounted to the transfer chamber, a modular mainframe plumbing tray and chamber trays associated with the process chambers. ...


7
Maydan Dan, Somekh Sasson, Wang David Nin Kou, Cheng David, Toshima Masato, Harari Isaac, Hoppe Peter D: Multiple chamber integrated process system.. Applied Materials, June 22, 1988: EP0272141-A2 (81 worldwide citation)

An integrated modular multiple chamber vacuum processing system (10) is disclosed. The system includes a load lock (12), may include an external cassette elevator (24), and an internal load lock wafer elevator (50), and also includes stations about the periphery of the load lock for connecting one, ...


8
Lasch Jr Cecil A, Bingham George H, Berz Gerhard, Troyer Earl G: Apparatus and method for handling and treating articles. Industrial Modular Systems Corporation, February 29, 1972: US3645581 (81 worldwide citation)

Improved apparatus and method for transporting articles and for centering articles in sequence by means of fluid-bearing devices. The apparatus and method disclosed have particular utility in the handling and treatment of fragile articles, such as silicon wafers, but their utility is not restricted ...


9
Levy Kenneth, Corbin David, Fleming Alan J, Friedman David, Fryklund Gilbert G, Parker Vance, Schliemann Gerd: Automatic wafer loading and pre-alignment system. The Computervision Corporation, Birch Richard J, September 2, 1975: US3902615 (71 worldwide citation)

An automatic wafer loading and pre-alignment system for integrated circuit wafer-mask Aligners. A belt feed track system is employed to transport wafers from a 'send' wafer storage carrier to a wafer pre-alignment station. The wafer is mechanically pre-aligned with respect to the wafer chuck of the ...


10
Bok Edward: Method and apparatus for transport of a substrate.. Bok Edward, September 14, 1983: EP0088091-A1 (62 worldwide citation)

Method and apparatus (10) for deposition of fluid and gaseous media on substrates (18), comprising a cabin (32), in which series of segments (34, 36, 38...68) are located aside a central passage (80, 96). Media, flowing through apertures between these segments towards and along substrates, passing t ...