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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi: Reconstituted wafer level stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 8, 2011: US07901989 (85 worldwide citation)

A stacked microelectronic assembly is fabricated from a structure which includes a plurality of first microelectronic elements having front faces bonded to a carrier. Each first microelectronic element may have a first edge and a plurality of first traces extending along the front face towards the f ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 20, 2014: US08728865 (54 worldwide citation)

A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and expos ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 15, 2011: US08058101 (50 worldwide citation)

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Vage Oganesian: Edge connect wafer level stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 9, 2010: US07829438 (39 worldwide citation)

In accordance with an aspect of the invention, a stacked microelectronic package is provided which may include a plurality of subassemblies, e.g., a first subassembly and a second subassembly underlying the first subassembly. A front face of the second subassembly may confront the rear face of the f ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Stacked packages with bridging traces. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 31, 2011: US07952195 (37 worldwide citation)

A microelectronic assembly that includes a first microelectronic element having a first rear surface. The assembly further includes a second microelectronic element having a second rear surface. The second microelectronic element is attached to the first microelectronic element so as to form a stack ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, March 26, 2013: US08405196 (22 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Giles Humpston: Microelectronic packages fabricated at the wafer level and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 20, 2010: US07759166 (20 worldwide citation)

A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, November 13, 2012: US08310036 (19 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic packages with nanoparticle joining. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 12, 2013: US08580607 (18 worldwide citation)

A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second comp ...


10
David Sherrer
David W Sherrer, Gregory A Ten Eyck, Dan A Steinberg, Neal Ricks: Single mask technique for making positive and negative micromachined features on a substrate. Shipley Company L L C, Jonathan D Baskin, September 30, 2003: US06627096 (17 worldwide citation)

Methods for making a micromachined device (e.g. an microoptical submount) having positive features (extending up from a device surface) and negative features (extending into the device surface). The present techniques locate the postive feature and negative features according to a single mask step. ...