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Somakumar R
BANERJEE ARIJIT, RAMACHANDRAPANICKER SOMAKUMAR, SUN HAIYAN, SAMANTA SUBHRA, MALLAMPALLI SRINIVAS SATYA SAI: [en] Detecting insulation deterioration or ground faults in the winding of a synchronous machine. GEN ELECTRIC, January 30, 2013: GB2493280-A (1 worldwide citation)

[en] A method for monitoring a synchronous machine 110 includes injecting a narrowband sinusoidal signal at a first end 116A of a field winding 114 of the synchronous machine and monitoring a voltage at a second end 116B of the field winding with respect to ground. The method then identifies a reson ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Test fixture with movable pin contacts. Tessera, Tessera, LERNER DAVID et al, February 16, 2006: US20060033515-A1

A fixture for testing microelectronic elements such as semiconductor chips. The test fixture includes a body and a flexible dielectric substrate supported above the body by support elements. Conductive posts are connected to the body with support elements. The conductive posts project from the surfa ...


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Gregory G Boll, Harry J Boll: Broadband impedance matching probe. Werner H Schroeder, May 8, 2001: US06229327 (246 worldwide citation)

A probe for testing integrated circuits at microwave frequencies employs a tapered coaxial transmission line to transform the impedance at the probe tips to the impedance of the test instruments. Mechanically resilient probe tip structures allow reliable probing of non-planar circuits and the elasti ...


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Oh Kyong Kwon, Masashi Hashimoto, Satwinder Malhi, Eng C Born: Full wafer integrated circuit testing device. Texas Instruments Incorporated, James C Kesterson, Douglas A Sorensen, Richard L Donaldson, December 3, 1991: US05070297 (239 worldwide citation)

A full wafer integrated circuit testing device (10) tests integrated circuits (15) formed as a wafer in conjunction with a test control unit (40). Probe units (14) associate with respective integrated circuits (15). Probe tips (16) on probe units (14) communicate with respective pads (19) with the i ...


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Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da Yuan Shih, George Frederick Walker: Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof. International Business Machines Corporation, Daniel P Morris, October 13, 1998: US05821763 (235 worldwide citation)

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compli ...


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Brian S Beaman, Keith E Fogel, Paul A Lauro, Maurice H Norcott, Da Yuan Shih, George F Walker: Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer. International Business Machines Corporation, Daniel P Morris, June 3, 1997: US05635846 (218 worldwide citation)

A high density test probe is for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard pack ...


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Robert B Marcus, William N Carr: Microprobe. Robert B Marcus, Roxburgh, Meltzer Lippe Goldstein et al, December 12, 1995: US05475318 (210 worldwide citation)

A microprobe comprises a base, a microcantilever extending in a plane from the base, and a probe tip projecting from the microcantilever out of the plane. The microcantilever is a bimorph structure comprising first and second layers made from materials having different coefficients of thermal expans ...


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Richard K Thompson, Ernesto Sevilla: Leakage capacitance compensating current sensor for current supplied to medical device loads. Conmed Corporation, Larson and Taylor, July 25, 1995: US05436566 (198 worldwide citation)

A current sensing device enables sensing the current being delivered from a source to a load at a medical implement connected to the distal end of a primary conductor connected between the source and the load in situations wherein distributed capacitance between the primary conductor and a return pa ...


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Thomas C Gordon: Apparatus and method for calibrated testing of a vehicle electrical system. Ford Motor Company, Peter Abolins, Clifford L Sadler, June 10, 1980: US04207611 (198 worldwide citation)

This specification discloses a vehicle electrical system tester which connects in parallel across the vehicle battery and the portion of the electrical system to be tested and measures voltage changes upon selective actuation of portions of the vehicle electrical system. Comparison of these measured ...


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Tim J Corbett, Alan G Wood: Discrete die burn-in for nonpackaged die. Micron Technology, Stanley N Protigal, Angus C Fox III, Jon P Busack, February 6, 1990: US04899107 (196 worldwide citation)

A reusable burn-in/test fixture for discrete TAB die consists of two halves. The first half of the test fixture is a die cavity plate for receiving semiconductor dice, and contains cavities in which die are inserted. The second half establishes electrical contact with the dice and with a burn-in ove ...