1
Richard E Huff, Farid Matta: Self-leveling membrane probe. Hewlett Packard Company, March 6, 1990: US04906920 (186 worldwide citation)

A self-leveling membrane probe [10] is disclosed. A carrier [12] supports a translation stage [18] through radial flexure pivots [14]. A flexible membrane [22] having a first and second side is stretched over the translation stage [28] and held in high tension across its central portion compared to ...


2
January Kister: Large scale protrusion membrane for semiconductor devices under test with very high pin counts. Probe Technology Corporation, Thomas E Schatzel, June 6, 1995: US05422574 (166 worldwide citation)

An embodiment of the present invention is a probe membrane with a center contact bump area and a plurality of signal connection sections separated by triangular reliefs in the membrane and terminating in a tangential row of contacts for wire bonding to a probe card. The system of triangular reliefs ...


3
John W Tarzwell: Probe device for integrated circuit wafers. Cerprobe Corporation, Spensley Horn & Lubitz, July 17, 1979: US04161692 (160 worldwide citation)

A probe device for testing integrated circuit wafers is disclosed. The probe device comprises a support means, which has metallized portions, and an aperture. A plurality of "L" shaped holding means, each having a thin metallized surface, are coupled to metallized portions of the support means so th ...


4
Robert E Drake, Sadeg M Faris, Roy M Patt, Zhi Yuan Shen: Soft probe for providing high speed on-wafer connections to a circuit. Hypres Incorporated, Kenyon & Kenyon, January 16, 1990: US04894612 (157 worldwide citation)

Miniature soft probes are used to provide a high speed connection to circuits on a wafer. The probe contains a co-planar line on a soft substrate which provides a flexibility for secure contacts. A miniature coaxial line is directly connected to the coplanar line with a zero degree angle. This confi ...


5
Mitsuya Sato, Takao Ukaji, Nobuhito Yamaguchi, Taro Ohmori, Eiichi Murakami: Wafer prober. Canon Kabushiki Kaisha, Morgan & Finnegan, May 29, 1990: US04929893 (151 worldwide citation)

A wafer prober usable with a probe card for examination of chips formed on a wafer is disclosed. The wafer prober has a function for automatically aligning bonding pads of each chip with probe needles of the probe card. The prober includes a contact plate movable in X and Y directions with a wafer c ...


6
Akin Aksu: Printed circuit board testing means. Fulwider Patton Rieber Lee & Utecht, July 20, 1976: US03970934 (146 worldwide citation)

There is disclosed a printed circuit board test fixture which comprises a housing, a pair of parallel, opposed platens with press means associated with at least one of the platens. One of the platens supports a printed circuit board and the other supports a plurality of spring-biased, probe contact ...


7
Arthur Evans, Joseph R Baker, Robert P Rising: Test probe assembly for testing integrated circuit devices. Wentworth Laboratories, Michael Ebert, December 4, 1990: US04975638 (144 worldwide citation)

A test probe assembly for testing an integrated circuit (IC) device having contact pads deployed in a predetermined pattern in a common plane. The assembly includes a contactor formed by a flexible film of dielectric material having a rectangular planar central zone from whose corners extend radial ...


8
Allan Boegh Petersen: Connector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circuit board by means of a circuit board testing machine. Dennison Meserole Pollack & Scheiner, November 17, 1987: US04707657 (143 worldwide citation)

In a circuit board testing machine for testing a circuit board of an electrically insulating material having circuit tracks of an electrically conductive material arranged on one side surface or on opposite side surfaces, a test surface (84) or two opposite test surfaces (84,84) is or are provided. ...


9
Frank J Ardezzone: High density probe-head with isolated and shielded transmission lines. Probe Rite, Thomas E Schatzel, January 13, 1987: US04636722 (138 worldwide citation)

A test probe head assembly having a probe assembly comprising a plurality of probe arms with terminal probe-points mounted on a support member with means for transmitting electrical signals between an external signal source and the probe's arms. The probe-points are resiliently mounted on the probe ...


10
Yuichi Abe, Masao Yamaguchi, Munetosi Nagasaka: Probe apparatus for testing multiple integrated circuit dies. Tokyo Electron, Tokyo Electron Yamanashi, Oblon Spivak McClelland Maier & Neustadt, May 28, 1996: US05521522 (131 worldwide citation)

There is provided a probe apparatus with a stage for holding a wafer on which a plurality of chips are regularly arranged such that the chips are arranged substantially in an XY plane, a large number of contactors facing the wafer held on the stage, provided to corresponding to respective pads of th ...