11
Robert S Wegeng, M Kevin Drost, Carolyn E McDonald: Microcomponent sheet architecture. Battelle Memorial Institute, Paul W Zimmerman, March 18, 1997: US05611214 (147 worldwide citation)

The invention is a microcomponent sheet architecture wherein macroscale unit processes are performed by microscale components. The sheet architecture may be a single laminate with a plurality of separate microcomponent sections or the sheet architecture may be a plurality of laminates with one or mo ...


12
Gregory W Swift, Albert Migliori, John C Wheatley: Microchannel crossflow fluid heat exchanger and method for its fabrication. The United States of America represented by the United States Deparment of Energy, William A Eklund, Paul D Gaetjens, Judson R Hightower, May 14, 1985: US04516632 (147 worldwide citation)

A microchannel crossflow fluid heat exchanger and a method for its fabrication are disclosed. The heat exchanger is formed from a stack of thin metal sheets which are bonded together. The stack consists of alternating slotted and unslotted sheets. Each of the slotted sheets includes multiple paralle ...


13
Lon E Bell: Thermoelectric heat exchanger. Amerigon, Knobbe Martens Olson & Bear, September 19, 2000: US06119463 (143 worldwide citation)

Disclosed is a system for thermally conditioning and pumping a fluid having use as a ventilation system for vehicle seats and other applications. The system includes a thermoelectric heat exchanger having a thermoelectric element configured to pump heat from one body to another body. A pair of heat ...


14
Akihiro Hosokawa: Method and apparatus for cooling semiconductor wafers. Applied Materials, Michael A Glenn, September 13, 1994: US05345999 (143 worldwide citation)

A semiconductor wafer cooling pedestal has a wafer cooling surface which includes both an electrostatic chuck portion to hold the wafer securely to the pedestal during wafer cooling and a thermal transfer portion to cool the wafer. The entire wafer cooling surface of the pedestal is mirror finished ...


15
David C Mundinger, D Philip Worland: Modular microchannel heat exchanger. March 17, 1998: US05727618 (142 worldwide citation)

A modular microchannel heat exchanger for cooling a heated region and a method for making the device. A first section of the device features an array of thin copper sheets which are etched with rows of elongated holes that pierce the sheets, coated with silver and held together with the holes aligne ...


16
Hong Lin Du, Norio Hachisu: Humidifier system for artificial respiration. Newport Medical Instruments, Procopio Cory Hargreaves & Savitch, September 30, 2008: US07428902 (138 worldwide citation)

A humidifier system for heating and humidifying respiratory gases has a housing with an inner chamber, a first port at the first end for connection to a ventilator breathing circuit and a second port at the second end for connection to a patient to supply respiratory gases to the patient and to rece ...


17
James D Aid: Container with tapered walls for heating or cooling fluids. Extracorporeal Medical Specialties, Mark A Hofer, March 11, 1986: US04574876 (137 worldwide citation)

Flexible container means for the warming or cooling of fluids. A preferred embodiment, useful for the warming of plasma following cryogellation techniques prior to its return to the patient, comprises container means formed by the heat sealing of polymeric materials thereby defining a winding passag ...


18
Michael J Cannell, Roger Cooley, Richard W Garman, Geoffrey Green, Peter N Harrison, Joseph D Walters: Fluid-cooled heat sink with turbulence-enhancing support pins. The United States of America represented by the Secretary of the Navy, Howard Kaiser, May 4, 2004: US06729383 (128 worldwide citation)

A pin array is connectively disposed between a surface region of a heat sink and a surface region of an entity to be cooled. Cooling fluid flows between the heat sink's surface region and the entity's surface region, the fluid flowing adjacent each surface region and through the space occu ...


19
Daniel Moulene, Pierre Gourdon: Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support. ETS Gourdon, Rosen Dainow & Jacobs, July 23, 1991: US05034688 (127 worldwide citation)

The invention concerns a temperature conditioning support for thermal tests on small objects such as semiconductor wafers incorporating integrated circuits. It consists of a platen and a hollow base. Inside the hollow cavity is contained a serpentine which can convey thermal fluid capable of heating ...


20
Kambiz Vafai, Lu Zhu: Two-layered micro channel heat sink, devices and systems incorporating same. The Ohio State University, Standley & Gilcrest, October 1, 2002: US06457515 (124 worldwide citation)

The present invention includes heat sinks, heat sink devices, and heat sink systems. The invention also includes machines or electronic devices using these aspects of the invention. The present invention also includes in broadest terms, an electronic device in thermal contact with a two-layered micr ...