1
Anthony Verdes, Yuming Chen: Light emitting diode (LED) light bulbs. Dialight Corporation, Oblon Spivak McClelland Maier & Neustadt P C, September 27, 2005: US06948829 (257 worldwide citation)

A light emitting diode (LED) light bulb that includes plural individual elements as sub-assembly elements of the overall light bulb. Different sub-assembly elements of a lens, a LED printed circuit board, a housing also functioning as a heat sink, a lower housing, and other individual sub-assembly c ...


2
George Chizinsky: Heated plate rapid thermal processor. Don Halgren, October 12, 1993: US05252807 (171 worldwide citation)

A rapid thermal processor for heat treating and cooling semiconductor material in an elongated process chamber having a base, side and top walls which enclose a heater plate assembly through which thin pins longitudinally move to carry workpieces vertically to and from the heater assembly. A cooling ...


3
Christian M Gronet, James F Gibbons: Rapid thermal heating apparatus and method. Applied Materials, Aldo J Test, October 13, 1992: US05155336 (156 worldwide citation)

A rapid thermal heating apparatus in which lamps are disposed in a plurality of light pipes arranged to illuminate and supply heat to a substrate. The light pipes are positioned so that the illumination patterns overlap. The energy supplied to the lamps is controlled to provide a predetermined heati ...


4
Beuret Pierre: Heat treatment installation for a batch of metallic workpieces. Beuret Pierre, April 26, 2000: EP0995805-A1 (147 worldwide citation)

Installation for thermal treatment of metallic parts comprises: a first assembly with at least one furnace, and a second assembly with at least one jig; one of the two assemblies is attached to a fixed structure (12) and the other assembly is connected to a moving structure (13) relatively to the fi ...


5
Anderson Emmett R: Temperature controlled profiling heater. Applied Materials, Flehr Hohbach Test Albritton & Herbert, September 17, 1974: US3836751 (116 worldwide citation)

Heater for producing and maintaining a desired temperature profile along angularly displaced axes. The heater includes a pair of radiant heat sources each having a plurality of heating elements spaced along an axis outside a chamber fabricated of a material which is transparent to the heat energy pr ...


6
Ronald E Sheets: Apparatus for heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc.. Tamarack Scientific Co, Gausewitz Carr & Rothenberg, March 10, 1987: US04649261 (111 worldwide citation)

An integrating light pipe, very preferably a kaleidoscope, encloses a source of radiant thermal energy, the light pipe and energy source being so arranged as to achieve efficient and substantially uniform heating of a workpiece in a target plane. The pipe has closed ends so as to heat the workpiece ...


7
Dennis L Wagner, Harold D Wells: Tunnel oven. Pet Incorporated, Kalish & Gilster, November 19, 1985: US04554437 (105 worldwide citation)

An infrared tunnel oven includes one or more oven tiers each having a horizontal cooking tunnel with entrance and exit at opposite ends, the tier(s) being supported by a base. Each tunnel is divided along its length into multiple heating zones. The roof and hearth surfaces of each tunnel are heated ...


8
Ronald E Sheets: Method of heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc.. Tamarack Scientific Co, Richard L Gausewitz, October 6, 1987: US04698486 (104 worldwide citation)

In accordance with the method, an integrating kaleidoscope and lamps combine to cause heating of a semiconductor wafer to achieve desired effects such as annealing, etc. In one form of the method, the heating of the wafer is such as to achieve rapid annealing by isothermal heating alone. In another ...


9
Jon C Goldman, Robert E Rappaport: Gas control system for chemical vapor deposition system. Thermco Products Corporation, George R Clark, Neil M Rose, Clifford A Dean, January 18, 1983: US04369031 (98 worldwide citation)

A gas flow control system in which several constituent gases are mixed and the mixture delivered through controlled injectors to a processing zone. Mass flow controllers control the injector flows with one of the controllers being a master and the other being slaved to provide a selected percentage ...


10
Tetsu Ohsawa: Heat treating apparatus. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, November 7, 1995: US05464313 (96 worldwide citation)

A heat treatment apparatus for semiconductor wafers is provided with a number, such as two, of heat treatment units which are arranged horizontally and which load wafer boats containing wafers from below. A wafer delivery section is provided to correspond to each of the two heat treatment units, and ...



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