1
Anthony Verdes, Yuming Chen: Light emitting diode (LED) light bulbs. Dialight Corporation, Oblon Spivak McClelland Maier & Neustadt P C, September 27, 2005: US06948829 (285 worldwide citation)

A light emitting diode (LED) light bulb that includes plural individual elements as sub-assembly elements of the overall light bulb. Different sub-assembly elements of a lens, a LED printed circuit board, a housing also functioning as a heat sink, a lower housing, and other individual sub-assembly c ...


2
George Chizinsky: Heated plate rapid thermal processor. Don Halgren, October 12, 1993: US05252807 (171 worldwide citation)

A rapid thermal processor for heat treating and cooling semiconductor material in an elongated process chamber having a base, side and top walls which enclose a heater plate assembly through which thin pins longitudinally move to carry workpieces vertically to and from the heater assembly. A cooling ...


3
Christian M Gronet, James F Gibbons: Rapid thermal heating apparatus and method. Applied Materials, Aldo J Test, October 13, 1992: US05155336 (158 worldwide citation)

A rapid thermal heating apparatus in which lamps are disposed in a plurality of light pipes arranged to illuminate and supply heat to a substrate. The light pipes are positioned so that the illumination patterns overlap. The energy supplied to the lamps is controlled to provide a predetermined heati ...


4
Beuret Pierre: Heat treatment installation for a batch of metallic workpieces. Beuret Pierre, April 26, 2000: EP0995805-A1 (150 worldwide citation)

Installation for thermal treatment of metallic parts comprises: a first assembly with at least one furnace, and a second assembly with at least one jig; one of the two assemblies is attached to a fixed structure (12) and the other assembly is connected to a moving structure (13) relatively to the fi ...


5
Anderson Emmett R: Temperature controlled profiling heater. Applied Materials, Flehr Hohbach Test Albritton & Herbert, September 17, 1974: US3836751 (117 worldwide citation)

Heater for producing and maintaining a desired temperature profile along angularly displaced axes. The heater includes a pair of radiant heat sources each having a plurality of heating elements spaced along an axis outside a chamber fabricated of a material which is transparent to the heat energy pr ...


6
Ronald E Sheets: Apparatus for heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc.. Tamarack Scientific Co, Gausewitz Carr & Rothenberg, March 10, 1987: US04649261 (114 worldwide citation)

An integrating light pipe, very preferably a kaleidoscope, encloses a source of radiant thermal energy, the light pipe and energy source being so arranged as to achieve efficient and substantially uniform heating of a workpiece in a target plane. The pipe has closed ends so as to heat the workpiece ...


7
Dennis L Wagner, Harold D Wells: Tunnel oven. Pet Incorporated, Kalish & Gilster, November 19, 1985: US04554437 (110 worldwide citation)

An infrared tunnel oven includes one or more oven tiers each having a horizontal cooking tunnel with entrance and exit at opposite ends, the tier(s) being supported by a base. Each tunnel is divided along its length into multiple heating zones. The roof and hearth surfaces of each tunnel are heated ...


8
Ronald E Sheets: Method of heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc.. Tamarack Scientific Co, Richard L Gausewitz, October 6, 1987: US04698486 (106 worldwide citation)

In accordance with the method, an integrating kaleidoscope and lamps combine to cause heating of a semiconductor wafer to achieve desired effects such as annealing, etc. In one form of the method, the heating of the wafer is such as to achieve rapid annealing by isothermal heating alone. In another ...


9
Ji hoon Hong, Ki heum Nam: Semiconductor wafer boat with reduced wafer contact area. Samsung Electronics, Jones Volentine, August 8, 2000: US06099302 (103 worldwide citation)

A boat for semiconductor wafers has reduced contact surface area with the wafer, thereby preventing distortion of the wafer during heating. The boat has an upper member; a lower member, a plurality of wafers being loaded between the upper member and the lower member; and a plurality of support membe ...


10
Gary M Moore, Katsuhito Nishikawa: Rapid thermal processing apparatus for processing semiconductor wafers. Moore Epitaxial, Forrest E Gunnison, Skjerven Morrill MacPherson Franklin & Friel, August 22, 1995: US05444217 (101 worldwide citation)

A novel rapid thermal process (RTP) reactor processes a multiplicity of wafers or a single large wafer, e.g., 200 mm (8 inches), 250 mm (10 inches), 300 mm (12 inches) diameter wafers, using either a single or dual heat source. The wafers or wafer are mounted on a rotatable susceptor supported by a ...