51
Peter P Pellegrino: Apparatus for electroplating, deplating or etching. Blakely Sokoloff Taylor & Zafman, November 13, 1979: US04174261 (50 worldwide citation)

Methods and apparatus for providing high and uniform processing rates for electroplating, deplating, etching and the like, substantially independent of the surface geometries of the article subjected to the process. In an electroplating application, the article to be plated is supported on a cathode ...


52
George D Case, Jennings F Worley III: Thin membrane sensor with biochemical switch. Keck Mahin & Cate, July 12, 1994: US05328847 (49 worldwide citation)

A modular biosensor system for chemical or biological agent detection utilizes electrochemical measurement of an ion current across a gate membrane triggered by the reaction of the target agent with a recognition protein conjugated to a channel blocker. The sensor system includes a bioresponse simul ...


53
Hong Long Chang, Ming Li Kung, Hungyueh Lu, Fang Fei Liu: Dry clean method instead of traditional wet clean after metal etch. ProMos Technologies, George O Saile, Stephen B Ackerman, Stephen G Stanton, March 4, 2003: US06526996 (48 worldwide citation)

A dry cleaning method for use in semiconductor fabrication, including the following steps. An etched metallization structure is provided and placed in a processing chamber. The etched metallization structure is cleaned by introducing a fluorine containing gas/oxygen containing gas mixture into the p ...


54
Helmut Foell, Volker Lehmann: Etching method for generating apertured openings or trenches in layers or substrates composed of n-doped silicon. Siemens Aktiengesellschaft, Hill Van Santen Steadman & Simpson, October 17, 1989: US04874484 (48 worldwide citation)

The present invention provides the production of apertured openings or trenches in layers or substrates composed of n-doped silicon proceeding in an electrolytic way, whereby the silicon is connected as a positively polarized electrode of an electrolysis cell containing an agent that contains hydrof ...


55
Donald C Young: Processes for the deposition or removal of metals. Union Oil Company of California, Michael H Laird, G Wirzbicki, D Sandford, July 5, 1988: US04755265 (47 worldwide citation)

Methods for depositing metals on or removing metals from substrates are provided which involve the use of electrolytic cells comprising an anode and cathode, sulfuric acid, and a chalcogen-containing compound soluble in said bath and having the empirical formula ##STR1## wherein X is a chalcogen, ea ...


56
Joseph C Andreshak, Madhav Datta, Lubomyr T Romankiw, Luis F Vega: Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands. International Business Machines Corporation, Ratner & Prestia, November 19, 1991: US05066370 (45 worldwide citation)

An apparatus is provided for electrochemically processing an anodic material in strip form, such as the stainless steel print bands used in high speed printers. Also provided is an electrochemical process including electroetching, electropolishing, or both to obtain microfinishing of the material. M ...


57
Lundquist Jr Joseph Theodore, Giner Jose D: Electrochemical system graduated porous bed sections. W R Grace & Co, Wise L Gene, November 11, 1975: US3919062 (45 worldwide citation)

A process and apparatus for conducting electrochemical treatment in a reaction zone containing electrically conductive particles, such as carbon pellets. A plurality of beds within an electrolysis reaction chamber are separated by foraminous insulators which define bed sections of varying thickness. ...


58
Per Petersson, Mikael Gustavsson, Jenny Sjöberg, Bin Xie, Bjarni Bjarnason, Gust Bierings, Göran Frennesson: Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching. Obducat Aktiebolag, Finnegan Henderson Farabow Garrett & Dunner L, December 2, 2003: US06656341 (43 worldwide citation)

In a method of etching a substrate having a surface layer of conductive material, a circuit pattern is transferred to the surface layer in a central surface area portion of the substrate by electrochemical etching. To prevent excessive current densities from forming at the periphery of the central s ...


59
Paul D Butterfield, Liang Yuh Chen, Yonqi Hu, Antoine P Manens, Rashid Mavliev, Stan D Tsai, Feng Q Liu, Ralph Wadensweiler, Lizhong Sun, Siew S Neo, Alain Duboust: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Moser Patterson & Sheridan, November 8, 2005: US06962524 (42 worldwide citation)

Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. ...


60
Ralph A Dalla Betta, James C Schlatter, David R Lane, Diana O Durieux: Self-contained system for controlling gaseous emissions from dilute organic sources and a process for using that system. Catalytica, Morrison & Foerster, May 3, 1994: US05308457 (42 worldwide citation)

This invention is a device and a process for controlling the emission of volatile organic components. The invention is useful on gaseous or vapor-containing streams containing a minor amount of organic material, particularly on fairly dilute streams or those containing only a few parts per million o ...