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Madhav Datta, Terrence R O Toole: Electrochemical metal removal technique for planarization of surfaces. IBM Corporation, Ratner & Prestia, October 22, 1996: US05567300 (198 worldwide citation)

A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendou ...


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Panayotis C Andricacos, Kirk G Berridge, John O Dukovic, Matteo Flotta, Jose Ordonez, Helmut R Poweleit, Jeffrey S Richter, Lubomyr T Romankiw, Otto P Schick, Frank Spera, Kwong Hon Wong: Vertical paddle plating cell. International Business Machines Corporation, Stephen S Strunck, Francis L Conte, May 14, 1996: US05516412 (164 worldwide citation)

An electroplating cell includes a floor, ceiling, front wall, and back wall forming a box having first and second opposite open ends. A rack for supporting an article to be electroplated is removably positioned vertically to close the first open end and includes a thief laterally surrounding the art ...


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Ian W Hunter, Serge R Lafontaine, John D Madden: Three dimensional microfabrication by localized electrodeposition and etching. June 24, 1997: US05641391 (163 worldwide citation)

Embodiments of the present invention provide a new method for producing a three dimensional object, particularly suited to microfabrication applications. The method includes the steps of providing a substrate with a conducting interface, an electrode having a feature or features that are small relat ...


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Steven T Mayer, Robert J Contolini, Anthony F Bernhardt: Method and apparatus for spatially uniform electropolishing and electrolytic etching. The United States of America represented by the United States Department of Energy, Henry P Sartorio, L E Carnahan, William R Moser, March 17, 1992: US05096550 (162 worldwide citation)

In an electropolishing or electrolytic etching apparatus the anode is separated from the cathode to prevent bubble transport to the anode and to produce a uniform current distribution at the anode by means of a solid nonconducting anode-cathode barrier. The anode extends into the top of the barrier ...


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Jingli Wang, Christopher J Tarapata, Matthew J Fitz: Electro-polishing fixture and electrolyte solution for polishing stents and method. Advanced Cardiovascular Systems, Fulwider Patton Lee & Utecht, April 23, 2002: US06375826 (155 worldwide citation)

An electro-polishing fixture for polishing stents which incorporates multiple anodes in contact with the stent and a center cathode disposed coaxially within the interior of the stent and a curved exterior cathode disposed about the perimeter of the stent. The invention further includes an electroly ...


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Alexander I Ershov, William F Marx: Systems and methods for reducing the influence of plasma-generated debris on the internal components of an EUV light source. Cymer, Matthew Hillman, William C Cray, March 27, 2007: US07196342 (149 worldwide citation)

Systems and methods are disclosed for reducing the influence of plasma generated debris on internal components of an EUV light source. In one aspect, an EUV meteorology monitor is provided which may have a heater to heat an internal multi-layer filtering mirror to a temperature sufficient to remove ...


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Anthony Andreacchi: Apparatus for electropolishing a stent. Advanced Cardiovascular Systems, Fulwider Patton Lee & Utecht, January 20, 2004: US06679980 (145 worldwide citation)

The invention is directed to an apparatus and a process for electropolishing a product or metallic device made from a metal alloy. The electropolishing apparatus includes a cathode formed of a tubular member and an anode formed by the metallic device to be electropolished. Both the tubular member an ...


18
Jose A Medina, Tiffany Yun Wen Jiang, Ming Jiang: Low-rate electrochemical etch of thin film metals and alloys. Western Digital, September 3, 2013: US08524068 (137 worldwide citation)

Embodiments of the present invention include systems and methods for low-rate electrochemical (wet) etch that use a net cathodic current or potential. In particular, some embodiments achieve controlled etch rates of less than 0.1 nm/s by applying a small net cathodic current to a substrate as the su ...


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Madhav Datta, Lubomyr T Romankiw: Electrochemical tool for uniform metal removal during electropolishing. International Business Machines Corporation, Scully Scott Murphy & Presser, June 8, 1993: US05217586 (129 worldwide citation)

The present invention relates to an electropolishing tool for the removal of metal from a workpiece, said electropolishing tool comprising a container means for retaining an electrolytic solution, a cathode assembly in the shape of a pyramid the height of which is adjustable, a power supply means in ...


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