Arkadii V Samoilov, Dale R DuBois, Bradley M Curelop, David R Carlson, Paul B Comita: Process and apparatus for cleaning a silicon surface. Applied Materials, Blakely Sokoloff Taylor & Zafman, December 17, 2002: US06494959 (142 worldwide citation)

A low pressure-high hydrogen flow rate process of cleaning a silicon wafer surface is described. The combination of process pressures below about 1 Torr with hydrogen flow rates up to about 3 SLM has been found to remove substantially all oxygen contamination from the silicon wafer surface at proces ...

Michael B Olesen, Mario E Bran: Semiconductor wafer cleaning system. Verteq, Knobbe Martens Olson & Bear, August 12, 1997: US05656097 (127 worldwide citation)

Semiconductor wafers are positioned in a cleaning tank and subjected to sequential flows of one or more highly diluted cleaning solutions that are injected from the lower end of the tank and allowed to overflow at the upper end. One solution contains one part ammonium hydroxide, two parts hydrogen p ...

Ichiro Hayashida, Masahiko Kakizawa, Kenichi Umekita, Hiroyoshi Nawa, Hisashi Muraoka: Surface treating cleaning method. Wako Pure Chemical, Purex, Armstrong Westerman Hattori McLeland & Naughton, March 1, 1994: US05290361 (118 worldwide citation)

A combination of a first surface treating solution comprising an inorganic or organic alkali such as ammonia or a quaternary ammonium hydroxide, hydrogen peroxide, water and a second surface treating solution of ultra-pure water, at least one of the first and second surface treating solutions contai ...

John Gregg, Scott Battle, Jeffrey I Banton, Donn Naito, Marianne Fuierer: Vaporizer delivery ampoule. Advanced Technology Materials, Marianne Fuierer, Margaret Chappuis, Tristan A Fuierer, July 26, 2005: US06921062 (104 worldwide citation)

A vaporizer delivery system for use in semiconductor manufacturing processes including a plurality of vertically stacked containers for holding a vaporizable source material. Each of the vertically stacked containers includes a plurality of vented protuberances extending into the interior of the eac ...

Robert J Small: Post clean treatment composition comprising an organic acid and hydroxylamine. EKC Technology, Cooley Godward, November 9, 1999: US05981454 (96 worldwide citation)

A composition for removal of chemical residues from metal or dielectric surfaces or for chemical mechanical polishing of a copper surface is an aqueous solution with a pH between about 3.5 and about 7. The composition contains a monofuctional, difunctional or trifunctional organic acid and a bufferi ...

Harold L Jackson: Paint remover. E I Du Pont de Nemours and Company, October 25, 1988: US04780235 (95 worldwide citation)

A low toxicity paint remover composition containing C.sub.1 to C.sub.4 dialkyl esters of C.sub.4 to C.sub.6 aliphatic dibasic acid, an activator, a thickener, a surfactant and at least one other organic nonhalogen-containing solvent.

Robert C McCune, Ronald J Baird: Making diamond composite coated cutting tools. Ford Motor Company, Joseph W Malleck, Roger L May, April 24, 1990: US04919974 (87 worldwide citation)

Method of making a composite coated article by the steps of: (a) initiating chemical vapor deposition of separated diamond or diamond-like particles onto a nondiamond or nondiamond-like substrate surface by use of low pressure metastable deposition of carbon in the presence of atomic hydrogen and at ...

Mihram Russell G, Snyder Gerald A: Process for cleaning radioactively contaminated metal surfaces. Halliburton Company, Weaver Thomas R, Laney William R, Tregoning John H, March 25, 1975: US3873362 (77 worldwide citation)

A process for removing radioactive scale from a ferrous metal surface, including the steps of initially pre-conditioning the surface by contacting it with an oxidizing solution (such as an aqueous solution of an alkali metal permanganate or hydrogen peroxide), then, after removal or decomposition of ...

Steven E Lentsch, Dale W Groth, Thomas R Oakes, Burton M Baum: Method of sanitizing and destaining tableware. Ecolab, Merchant Gould Smith Edell Welter & Schmidt, November 26, 1996: US05578134 (71 worldwide citation)

A method of sanitizing and destaining ware, including silverware includes the steps of applying a sanitizing concentrate composition to silverware at a rate of 100 ppm to 2000 ppm, the sanitizing concentrate composition including from about 1 wt-% to 20 wt-% of peroxycarboxylic acid, from about 10 w ...

Michael E Hayes, Craig C Hood, Ronald E Miller, Robert Sharpe: Method for printed circuit board and/or printed wiring board cleaning. Petroleum Fermentations, Pennie & Edmonds, February 3, 1987: US04640719 (68 worldwide citation)

Methods and compositions are provided for the removal of rosin soldering flux and adhesive tape residues from printed circuit and/or wiring boards, and for testing the quality of curing of U.V.-cured soldermask on such boards. The compositions of the invention contain terpene compounds, preferably i ...