1
Masayuki Endo, Akemi Kawaguchi, Mikio Nishio, Shin Hashimoto: Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device. Matsushita Electric Industrial, McDermott Will & Emery, July 8, 1997: US05645628 (96 worldwide citation)

A contact hole and a wiring groove are formed in an insulating layer formed on a semiconductor substrate. A silver layer is formed inside of the contact hole and the wiring groove and on the insulating layer with the use of an electroless plating bath comprising: silver nitrate containing silver ion ...


2
Goosey Martin T, Graves John E, Buch Joachim, Poole Mark A, Hirst Deborah, Holland Rebecca: Electroless plating processes. Shipley Co, May 6, 1999: EP0913498-A1 (94 worldwide citation)

The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. ...


3
Saijo Yasuhiko, Shimoyama Masashi, Yokota Hiroshi, Tashiro Akihiko, Wang Xinming, Takagi Daisuke: Method and apparatus for forming capping film. Ebara, January 12, 2005: EP1496542-A2 (78 worldwide citation)

A capping film serving as an interconnect protective film formed on a surface of interconnect metal on a semiconductor substrate is formed after forming a catalyst layer for electroless plating under low oxygen concentration condition. A method for forming a capping film for protecting a surface of ...


4
Jensen Darwin P: Copper plating on zinc and its alloys. February 13, 1973: US3716462 (58 worldwide citation)

Production of a uniform, continuous corrosion resistant bonded copper coating on a zinc or zinc alloy body, by a process which comprises contacting the zinc or zinc alloy body with an electroless copper plating composition or solution consisting essentially of a soluble copper salt, e.g., copper sul ...


5
Stahl Fritz Theodor, Steffen Hedwij Maria, Schneble Jr Frederick W, McCormack John F: Base material and method for the manufacture of printed circuits. Photocircuits Corporation, December 7, 1971: US3625758 (49 worldwide citation)

This invention relates to metallizing insulating base materials and more particularly to rendering insulating materials sensitive to electroless metal deposition and then depositing electroless metal on the sensitized material, and to the resulting new and improved metallized articles, including pri ...


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Kawakami Soichiro, Kobayashi Naoya, Asao Masaya, Kosuzu Takeshi, Kimura Hironao: Electrode structural body, rechargeable battery provided with said electrode structural body, and process for the production of said electrode structural body and said rechargeable battery. Canon, July 29, 1998: EP0855752-A2 (39 worldwide citation)

An electrode structural body comprising a plate-like shaped collector having opposite surfaces and an electrode material layer formed on at least one of said opposite surfaces of said collector, wherein said electrode material layer contains 35% by weight or more of a grained host matrix material of ...


8
Clauss Richard J: Process for acid copper plating of zinc. Udylite Corporation, May 23, 1972: US3664933 (33 worldwide citation)

A process for the acid copper plating of zinc, particularly complex zinc parts having recessed areas, wherein a displacement copper deposit is formed on the zinc surface by treatment with an immersion copper plating bath and, thereafter, the thus-plated surface is electroplated with copper from an a ...


9
Metzger Willy, Ott Rudi, Pappe Gunter, Schmidt Helmut: Process for electroless metallizing incorporating wear-resisting particles. General American Transportation Corporation, November 2, 1971: US3617363 (32 worldwide citation)

There are disclosed processes for electroless metallizing workpieces to provide thereon a metal coating incorporating therein nonmetallic wear-resisting particles and the coated workpieces produced by such processes, the processes comprising contacting the workpieces with an electroless metallizing ...


10
Tricia Lynn Breen, Sarah Jane Vella, Ali Afzali Ardakani, Mahmoud Mostafa Khojasteh: Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization. International Business Machines Corporation, Ohlandt Greeley Ruggiero & Perte L, Daniel P Morris Esq, August 8, 2006: US07087267 (30 worldwide citation)

A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes, nanoparticles, or colloids; apply ...