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Shyam Venkataraman
Raman Vijay Immanuel, Li Yuzhuo, Schade Christian, Venkataraman Shyam Sundar, Yu Shen Eason Su, Usman Ibrahim Sheik Ansar: [fr] COMPOSITION CHIMIQUE DE POLISSAGE MÉCANIQUE COMPRENANT DE LACIDE DE POLYVINYLE PHOSPHONIQUE ET SES DÉRIVÉS, [en] CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING POLYVINYL PHOSPHONIC ACID AND ITS DERIVATIVES. Raman Vijay Immanuel, Li Yuzhuo, Schade Christian, Venkataraman Shyam Sundar, Yu Shen Eason Su, Usman Ibrahim Sheik Ansar, BASF SE, BASF, June 27, 2013: WO/2013/093557 (2 worldwide citation)

[en] A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(=O)(OR1)(OR2) ) or phosp ...


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Shyam Venkataraman
VENKATARAMAN Shyam Sundar, YU SHEN Eason Su: [fr] PROCÉDÉ DE FABRICATION DUNE COMPOSITION DE POLISSAGE CHIMICO-MÉCANIQUE (CMP) ET SON APPLICATION, [en] METHOD FOR MANUFACTURING CMP COMPOSITION AND APPLICATION THEREOF. VENKATARAMAN Shyam Sundar, YU SHEN Eason Su, BASF SE, BASF, June 27, 2013: WO/2013/093556

[en] Provided is a process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of borophosphosilicate glass (BPSG) material in the presence of a chemical mechanical polishing (CMP) composition which comprises: (A) inorganic particles, organic particles, or a mix ...


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