1
Liu Yao Ching Eastman Kodak Co, Edwards Ray Eastman Kodak Comp: Maleated polypropylene blends for melt-bonding applications.. Eastman Kodak Co, January 16, 1991: EP0408470-A1 (31 worldwide citation)

Novel polypropylene compositions are disclosed which display good adhesion to a variety of substrates and which are capable of melt-bonding. Invention compositions can optionally be combined with extrusion coating grade polyethylene and employed for extrusion coating. Invention composition is also u ...


2
Adhesive comprising propylene, polyethylene and acid-grafted polyethylene. Acc Chem Co, Getty Chemical Co, February 24, 1982: GB2081723-A (24 worldwide citation)

A modified polyolefin adhesive blend comprises: (a) 0.1 to 40 parts of a graft copolymer of 70 to 99.999% of a polyethylene backbone grafted with 30 to 0.001% of at least one polymerizable ethylenically unsaturated carboxylic acid or anhydride, and (b) 99.9 to 60 parts of a mixture of 25 to 75% of l ...


3
Adur Ashok Mohan, Schmukler Seymour, Machonis John, Shida Mitsuzo: Olefin polymer adhesive compositions. Acc Chem Co, Getty Chemical Co, August 10, 1983: GB2113696-A (23 worldwide citation)

Adhesive blends that are strong adhesives to various substrates and especially to polar substrates, comprise (a) a graft copolymer of a polyethylene backbone grafted with at least one grafting monomer which is a polymerizable ethylenically unsaturated carboxylic acid or derivative thereof, (b) a LDP ...


4
Beuzelin Catherine, Hert Marius, Jammet Jean Claude, Trolez Yves: Coextrusion binder based on grafted polyolefins. Atochem Elf, November 13, 1996: EP0742236-A1 (20 worldwide citation)

A binder comprises (A) a mixt. of (A1) a high density polyethylene and (A2) an ethylene copolymer, with the mixt. co-grafted with a monomer, e.g. an unsatd. carboxylic acid or anhydride or deriv. The co-grafted mixt. has a ratio of MI10/MI2 above 18.5, where MI10 is the flow index under a 10 kg load ...


5
Wang Baoyu, Luebkert Malcolm R Iii: Hot melt adhesive based on blends of epr and/or epdm and semicrystalline olefinic polymers. Ato Findley, June 19, 2002: EP1214386-A1 (19 worldwide citation)

An elastomeric-based hot melt adhesive composition having a variety of end uses, particularly in construction and elastic attachment applications on nonwoven disposable articles. The composition includes an elastomeric rubber polymer or a mixture of elastomeric rubber polymers together with a semicr ...


6
Godfrey Darryl A: Polyethylene based hot-melt adhesive. Fuller H B Licensing Financ, October 29, 1997: EP0803559-A1 (16 worldwide citation)

Hot-melt adhesive compositions useful for packaging are disclosed. These hot-melt adhesive compositions are based on modified polyethylene and contain a linear, low density copolymer or terpolymer of ethylene and another alpha-olefin, a polyethylene graft copolymer, a tackifying resin, and a high-me ...


7
Takeda Masami, Nagano Riichiro: Hot melt composition.. Mitsui Petrochemical, May 28, 1980: EP0011474-A1 (12 worldwide citation)

The composition comprises a tackifier and a polymer having a melt index at 230 DEG C not exceeding 500, the polymer being formed by reacting an unsaturated carboxylic acid, or derivative thereof, with an ethylene - alpha olefin copolymer rubber, and, optionally, partially esterifying the resulting p ...


8
Hohner Gerd Dr: Modified polyolefin waxes. Clariant, February 23, 2005: EP1508579-A1 (11 worldwide citation)

A radically silane-modified partially crystalline polyolefin homo- or co-polymer wax of melt viscosity 10-50000 mPa.s at 170 deg. C and melt heat above 10 J/g is such that - (a) the modifying silane has at least one olefinic double bond and at least one alkoxy group directly bonded to a silicon atom ...


9
Sebastian S Plamthottam, Roger H Mann, John O Landers: Olefin polymer based pressure-sensitive adhesives. Avery Dennison Corporation, Christie Parker & Hale, September 14, 1993: US05244962 (11 worldwide citation)

There are provided pressure-sensitive adhesives which comprise free radical cured mixtures of at least one crosslinkable olefin polymer and at least one tackifying organic additive, preferably a hydrogenated additive, which is substantially nonresponsive to action of free radicals and present in an ...


10
Kodemura Junji: Adhesive for semiconductor components. Nippon Zeon, April 26, 2000: EP0995784-A1 (10 worldwide citation)

An adhesive for semiconductor parts, comprising, as a base polymer, at least one cyclic structure-containing thermoplastic polymer selected from the group consisting of (a) a cycloolefin polymer and (b) an aromatic-condensed polymer having a repeating unit of an aromatic ring in its main chain, and ...