Anubhav Saxena
Anubhav Saxena, Sandeep Naik, Pranav Ramchandra Joshi, Alok Sarkar, Monjit Phukan: Free radical polymerizable compositions comprising ionic silicones. Momentive Performance Materials, Dominick G Vicari, Joseph S Ostroff, September 16, 2014: US08835583

A composition including an actinic radiation or thermally curable polyorganosiloxane ionomer having one or more reactive groups, for example, vinyl, acrylate, epoxy groups.

Jean-luc Dubois
Samuel Devisme, Fabrice R Chop, Jean Laurent Pradel, Guillaume Le, Thomas Roussel, Jean Luc Dubois: Composition containing polypropylene and/or a propylene copolymer obtained from renewable materials, and uses thereof. Arkema France, December 15, 2011: US20110305900-A1

The present application relates to a method for manufacturing a propylene polymer, including: a) fermenting and optionally purifying first renewable materials to produce an alcohol or an alcohol mixture, the alcohol or alcohol mixture including at least isopropanol and/or at least a mixture of ethan ...

Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba, Klaus Jurgen Wolter: Microelectronic joining processes. Tessera, Lerner David Litenberg Krumholz & Mentlik, February 26, 2004: US20040035519-A1

A microelectronic element is with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic packaging methods and components. Lerner David Littenberg Krumholz & Mentlik, June 20, 2002: US20020074081-A1

A sheet including lead regions with conductors and a main region surrounding the lead regions is formed on the front surface of a microelectronic element such as a wafer, or assembled thereto, so that the conductors are connected to contacts on the microelectronic element. After the sheet is in plac ...

Brian Thomas
Brian Thomas, Donald Yakimicki: Synthetic polymer adhesives and methods for making, using and delivering the same. Zimmer, Schwegman Lundberg & Woessner P A, September 1, 2015: US09119605

A synthetic polymer based adhesive formulation that has properties substantially simulating selected properties of fibrin glue, and methods of making and using the same. The adhesive formulation includes a discrete acid solution and discrete base solution that when combined form a synthetic polymer ...

Mccracken Robert Wylie, Baesler Linda Anne: Adhesive film dressing.. Johnson & Johnson Prod, September 5, 1984: EP0117632-A2 (512 worldwide citation)

A thin adhesive coated film dressing is provided with the adhesive surface covered by a release paper in three sections to facilitate the application of the dressing to the wound site. The construction of the dressing provides for the center section of the release paper to be removed to expose the c ...

Ralf Korpman: Pressure-sensitive adhesive tape having extensible and elastic backing composed of a block copolymer. Johnson & Johnson, May 17, 1977: US04024312 (404 worldwide citation)

A highly conformable adhesive tape which comprises a highly extensible and elastic backing film laminated with an adhesive layer to form the tape. The adhesive is a normally tacky and pressure-sensitive elastomeric adhesive coated on at least one of the film surfaces. The film possesses a lengthwise ...

Sprague Jr Gordon V: Adhesive process. USM Corporation, Pollard Benjamin C, White Vincent A, Megley Richard B, October 7, 1975: US3911173 (314 worldwide citation)

Process for applying adhesive to a surface, particularly for attaching a tread member to a shoe in which an adhesive applicator including a jet providing a gas stream having a rotational component is constructed to extrude viscous fluid adhesive to form a filament and to lay down the filament while ...

Masaaki Yasumoto, Hiroshi Hayama, Tadayoshi Enomoto: Process of fabricating three-dimensional semiconductor device. NEC Corporation, Sughrue Mion Zinn Macpeak and Seas, September 16, 1986: US04612083 (300 worldwide citation)

A process of fabricating a three-dimensional semiconductor device, comprising the steps of preparing at least two multilayer structures each including at least one semiconductor element and a conductor connected at one end to the semiconductor element and having at the other end an exposed surface, ...

Hodgson Martin E: Moisture-vapor-permeable pressure-sensitive adhesive materials. T J Smith & Nephew, February 29, 1972: US3645835 (279 worldwide citation)

This invention relates to a moisture-vapor-permeable pressure-sensitive adhesive material for use on animal skin and nails, e.g. a surgical drape, suture strip or sheet, adhesive dressing, bandage, plaster, strapping tape, decorative nail covering, or decorative cosmetic product. The adhesive materi ...