IPC C09G (1 - 10 of 8,364 results)

2 patents

Senior Consultant at Precise Systems

Houston, Texas Area | Chemicals

Shyam Venkataraman
NOLLER Bastian, FRANZ Diana, LI Yuzhuo, USMAN IBRAHIM Sheik Ansar, PINDER Harvey Wayne, VENKATARAMAN Shyam Sundar: COMPOSITIONS DE POLISSAGE AQUEUSES CONTENANT DES DIOXYDES DE DIAZÉNIUM N-SUBSTITUÉS ET/OU DES SELS DOXYDE DE N-HYDROXY-DIAZÉNIUM, AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N-HYDROXY-DIAZENIUM OXIDE SALTS. BASF SE, NOLLER Bastian, FRANZ Diana, LI Yuzhuo, USMAN IBRAHIM Sheik Ansar, PINDER Harvey Wayne, VENKATARAMAN Shyam Sundar, BASF, March 15, 2012: WO/2012/032466 (3 worldwide citation)

An aqueous polishing composition comprising (A) at least one water-soluble or water-dispersible compound selected from the group consisting of N-substituted diazenium dioxides and N'-hydroxy-diazenium oxide salts; and (B) at least one type of abrasive particles; the use of the compounds (A) for manu ...

Shyam Venkataraman
Raman Vijay Immanuel, Li Yuzhuo, Schade Christian, Venkataraman Shyam Sundar, Yu Shen Eason Su, Usman Ibrahim Sheik Ansar: [fr] COMPOSITION CHIMIQUE DE POLISSAGE MÉCANIQUE COMPRENANT DE LACIDE DE POLYVINYLE PHOSPHONIQUE ET SES DÉRIVÉS, [en] CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING POLYVINYL PHOSPHONIC ACID AND ITS DERIVATIVES. Raman Vijay Immanuel, Li Yuzhuo, Schade Christian, Venkataraman Shyam Sundar, Yu Shen Eason Su, Usman Ibrahim Sheik Ansar, BASF SE, BASF, June 27, 2013: WO/2013/093557 (2 worldwide citation)

[en] A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(=O)(OR1)(OR2) ) or phosp ...

Shyam Venkataraman
LI Yuzhuo, CHU Jea Ju, VENKATARAMAN Shyam Sundar, USMAN IBRAHIM Sheik Ansar, PINDER Harvey Wayne: COMPOSITION AQUEUSE DE POLISSAGE ET PROCÉDÉ DE POLISSAGE MÉCANO-CHIMIQUE DE SUBSTRATS POUR DES DISPOSITIFS ÉLECTRIQUES, MÉCANIQUES ET OPTIQUES, AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES. BASF SE, LI Yuzhuo, CHU Jea Ju, VENKATARAMAN Shyam Sundar, USMAN IBRAHIM Sheik Ansar, PINDER Harvey Wayne, BASF, March 15, 2012: WO/2012/032461 (1 worldwide citation)

An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) ...

Shyam Venkataraman
VENKATARAMAN SHYAM SUNDAR, SU EASON YU SHEN, KINGMA AREND JOUKE, NOLLER BASTIAN MARTEN: [fr] COMPOSITION DE POLISSAGE AQUEUSE ET PROCÉDÉ DE POLISSAGE MÉCANO-CHIMIQUE DE SUBSTRATS CONTENANT UN DIÉLECTRIQUE EN OXYDE DE SILICIUM ET DES FILMS EN POLYSILICIUM, [de] WÄSSRIGE POLIERZUSAMMENSETZUNG UND VERFAHREN ZUM CHEMISCH-MECHANISCHEN POLIEREN VON SUBSTRATEN MIT DIELEKTRISCHEN SILICIUMOXID- UND POLYSILICIUMFILMEN, [en] AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS. BASF SE, October 16, 2013: EP2649144-A1

Shyam Venkataraman
LI YUZHUO, CHU JEA JU, VENKATARAMAN SHYAM SUNDAR, USMAN IBRAHIM SHEIK ANSAR, PINDER HARVEY WAYNE: [fr] COMPOSITION AQUEUSE DE POLISSAGE ET PROCÉDÉ DE POLISSAGE MÉCANO-CHIMIQUE DE SUBSTRATS POUR DES DISPOSITIFS ÉLECTRIQUES, MÉCANIQUES ET OPTIQUES, [de] WÄSSRIGE POLIERZUSAMMENSETZUNG UND VERFAHREN ZUM CHEMISCH-MECHANISCH POLIEREN VON SUBSTRATEN FÜR ELEKTRISCHE, MECHANISCHE UND OPTISCHE VORRICHTUNGEN, [en] AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES. BASF SE, July 17, 2013: EP2614121-A1

Shyam Venkataraman
NOLLER BASTIAN, FRANZ DIANA, LI YUZHUO, USMAN IBRAHIM SHEIK ANSAR, PINDER HARVEY WAYNE, VENKATARAMAN SHYAM SUNDAR: [fr] COMPOSITIONS DE POLISSAGE AQUEUSES CONTENANT DES DIOXYDES DE DIAZÉNIUM N-SUBSTITUÉS ET/OU DES SELS DOXYDE DE N-HYDROXY-DIAZÉNIUM, [de] WÄSSRIGE REINIGUNGSZUSAMMENSETZUNGEN MIT N-SUBSTITUIERTEN DIAZENIUMDIOXIDEN UND/ODER N-HYDROXY-DIAZENIUM-OXIDSALZEN, [en] AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N-HYDROXY-DIAZENIUM OXIDE SALTS. BASF SE, July 17, 2013: EP2614122-A1

Shyam Venkataraman
LI YUZHUO, CHU JEA JU, VENKATARAMAN SHYAM SUNDAR, USMAN IBRAHIM SHEIK ANSAR, PINDER HARVEY WAYNE: [fr] COMPOSITION AQUEUSE DE POLISSAGE ET PROCÉDÉ DE POLISSAGE CHIMICO-MÉCANIQUE DE MATÉRIAUX DE SUBSTRAT POUR DISPOSITIFS OPTIQUES, MÉCANIQUES ET ÉLECTRIQUES, [de] WÄSSRIGE POLIERZUSAMMENSETZUNG UND VERFAHREN ZUM CHEMISCH-MECHANISCH POLIEREN VON SUBSTRATMATERIALIEN FÜR ELEKTRISCHE, MECHANISCHE UND OPTISCHE VORRICHTUNGEN, [en] AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES. BASF SE, July 17, 2013: EP2614123-A1

Shyam Venkataraman
LAUTER MICHAEL, RAMAN VIJAY IMMANUEL, LI YUZHUO, VENKATARAMAN SHYAM SUNDAR, SHEN DANIEL KWO HUNG: COMPOSITION DE POLISSAGE CHIMICO-MÉCANIQUE (CMP) COMPRENANT DES PARTICULES INORGANIQUES ET DES PARTICULES POLYMÈRES, CHEMISCH-MECHANISCHE POLIERZUSAMMENSETZUNG MIT ANORGANISCHEN PARTIKELN UND POLYMERPARTIKELN, A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING INORGANIC PARTICLES AND POLYMER PARTICLES. BASF SE, September 19, 2012: EP2499210-A1

Shyam Venkataraman
Venkataraman Shyam Sundar, SU Eason Yu Shen, Kingma Arend Jouke, Noller Bastian Marten: COMPOSITION DE POLISSAGE AQUEUSE ET PROCÉDÉ DE POLISSAGE MÉCANO-CHIMIQUE DE SUBSTRATS CONTENANT UN DIÉLECTRIQUE EN OXYDE DE SILICIUM ET DES FILMS EN POLYSILICIUM, AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS. BASF SE, Venkataraman Shyam Sundar, SU Eason Yu Shen, Kingma Arend Jouke, Noller Bastian Marten, BASF, June 14, 2012: WO/2012/077063

An aqueous polishing composition comprising (A) abrasive ceria particles and (B) amphiphilic nonionic surfactants selected water-soluble and water-dispersible, linear and branched polyoxyalkylene blockcopolymers of the general formula I: R[(B1)m/(B2)nY]p (I), wherein the indices and the variables ha ...

Shyam Venkataraman
LI Yuzhuo, CHU Jea Ju, VENKATARAMAN Shyam Sundar, USMAN IBRAHIM Sheik Ansar, PINDER Harvey Wayne: COMPOSITION AQUEUSE DE POLISSAGE ET PROCÉDÉ DE POLISSAGE CHIMICO-MÉCANIQUE DE MATÉRIAUX DE SUBSTRAT POUR DISPOSITIFS OPTIQUES, MÉCANIQUES ET ÉLECTRIQUES, AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES. BASF SE, LI Yuzhuo, CHU Jea Ju, VENKATARAMAN Shyam Sundar, USMAN IBRAHIM Sheik Ansar, PINDER Harvey Wayne, BASF, March 15, 2012: WO/2012/032469

An aqueous polishing composition comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) water-soluble and water-dispersible hydroxy group containing components select ...

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