1
Ivo Koutsaroff 掘露 伊保龍
YAMAMOTO KANSHO, YAMAMOTO TEIJI, KOUTSAROFF P IVO: [fr] ACTIONNEUR PIÉZO-ÉLECTRIQUE ET SON PROCÉDÉ DE FABRICATION, [de] PIEZOELEKTRISCHER AKTUATOR UND HERSTELLUNGSVERFAHREN FÜR DEN PIEZOELEKTRISCHEN AKTUATOR, [en] PIEZOELECTRIC ACTUATOR AND MANUFACTURING METHOD FOR PIEZOELECTRIC ACTUATOR. MURATA MANUFACTURING CO, February 27, 2013: EP2562836-A1

[en] A piezoelectric actuator is realized which can be formed by means of a simpler configuration and a simpler manufacturing flow than in the related art. A fixed electrode (12) is formed in a base substrate (11). A dielectric layer (13) is formed on the surface of the base substrate (11). A lower ...


2
Ivo Koutsaroff 掘露 伊保龍
YAMAMOTO Kansho, YAMAMOTO Teiji, KOUTSAROFF P Ivo: 圧電アクチュエータおよび圧電アクチュエータの製造方法, Actionneur piézo-électrique et son procédé de fabrication, Piezoelectric actuator and manufacturing method for piezoelectric actuator. Murata Manufacturing, YAMAMOTO Kansho, YAMAMOTO Teiji, KOUTSAROFF P Ivo, Kaede Patent Attorneys Office, October 27, 2011: WO/2011/132532

Disclosed is a piezoelectric actuator with improved simplicity of construction and manufacturing flow. A fixed electrode (12) is formed on a base substrate (11). A dielectric layer (13) is formed on the surface of the base substrate (11). A lower electrode (14), at least one part of which is formed ...


3
Faiz Feisal Sherman, Vadim Vladimirovich Yuzhakov, Vladimir Gartstein, Grover David Owens: Apparatus and method for manufacturing an intracutaneous microneedle array. The Procter & Gamble Company, Bart S Hersko, November 6, 2001: US06312612 (271 worldwide citation)

A microneedle array is constructed of silicon and silicon dioxide compounds using MEMS (i.e., Micro-Electro-Mechanical-Systems) technology and standard microfabrication techniques. The microneedle array may be fabricated from a silicon die which can be etched in a microfabrication process to create ...


4
Kato Takahisa, Yagi Takayuki, Shimada Yasuhiro, Furukawa Yukio: Light deflector, method of manufacturing light deflector, optical device using light deflector, and torsion oscillating member. Canon, January 15, 2003: EP1275997-A2 (150 worldwide citation)

There is disclosed a light deflector in which both ends of a movable plate is supported to a support substrate by an elastic support portion, a reflection surface is formed on one surface of the movable plate, and the movable plate is torsion-oscillated about a torsion axis of the elastic support po ...


5
Yasuda Susumu: Interferrometric modulation device. Canon, February 28, 2002: JP2002-062490 (140 worldwide citation)

PROBLEM TO BE SOLVED: To increase the switching speed of a interferometric modulation(IMOD) device and to represent gradations without increasing the number of pixels.SOLUTION: A movable membrane 201 constituting one pixel is supported on a substrate (not illustrate) by a prop 202. The movable membr ...


6
Ikeda Koichi, Kinoshita Takashi: Electrostatic drive type mems element and manufacturing method therefor, optical mems element, optical modulator, glv device and laser display. Sony, December 2, 2003: JP2003-340795 (98 worldwide citation)

PROBLEM TO BE SOLVED: To flatten a beam composing an electrostatic drive type MEMS element or stabilize and uniformalize a beam shape. SOLUTION: The electrostatic drive type MEMS element comprises a substrate side electrode 33, a beam 36 disposed opposite to the substrate side electrode 33, having a ...


7
Jonathan C Doan, Satyadev R Patel, Andrew G Huibers, Jason S Reid: Methods for forming and releasing microelectromechanical structures. Reflectivity, Gregory R Muir, November 1, 2005: US06960305 (92 worldwide citation)

A method for making a spatial light modulator is disclosed, that comprises forming an array of micromirrors each having a hinge and a micromirror plate held via the hinge on a substrate, the micromirror plate being disposed in a plane separate from the hinge and having a hinge made of a transition m ...


8
Kimura Koichi, Mochizuki Fumihiko: Optical modulator array and method of manufacturing same. Fuji Photo Film, July 29, 2004: JP2004-212680 (86 worldwide citation)

PROBLEM TO BE SOLVED: To provide an optical modulator array in which the decrease in film and a residual stress of a movable transparent electrode due to a removing process of a sacrificial layer for making a gap are suppressed and the moving operation of the movable part is stably performed, and to ...


9
Vladimir I Vaganov: Methods for wafer to wafer bonding using microstructures. MegaSense, Norman R Klivans, Skjerven Morrill MacPherson, June 18, 2002: US06406636 (79 worldwide citation)

Wafer-to-wafer bonding using, e.g., solder metal bonding, glass bonding or polymer (adhesive) bonding is improved by profiling one or both of the wafer surfaces being bonded to define microstructures therein. Profiling means providing other than the conventional planar bonding surface to define cavi ...


10
Ouelett Luc, Antaki Robert: Fabrication of advanced silicon-based mems devices. Dalsa Semiconductor, September 1, 2004: EP1452481-A2 (73 worldwide citation)

A micro-electro-mechanical (MEM) device and an electronic device are fabricated on a common substrate by fabricating the electronic device comprising a plurality of electronic components on the common substrate, depositing a thermally stable interconnect layer on the electronic device, encapsulating ...



Click the thumbnails below to visualize the patent trend.