1
Frederick Schmid, Chandra P Khattak, Maynard B Smith: Multi-wafer slicing with a fixed abrasive. Crystal Systems, March 3, 1987: US04646710 (178 worldwide citation)

A wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.


2
Bert Ripper, Christian Andrae, Karl Egglhuber, Holger Lundt, Helmut Kölker, Jochen Greim: Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece. Wacker Chemie, Wacker Siltronic Gesellschaft für Halbleitermaterialien, Collard & Roe P C, October 2, 2001: US06295977 (154 worldwide citation)

A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a translational relative movement, directed perpendicular to the longitudinal axis, between the workpiece an ...


3
Ronald James Scherer, David M LaCroix: Block splitter assembly. Anchor Wall Systems, Merchant & Gould PC, November 27, 2001: US06321740 (145 worldwide citation)

The invention is a block splitting machine which uses an assortment of protrusions to supplement or replace the action of the splitting blade in splitting and dressing masonry block.


4
Bruel Michel: Process for manufacturing thin film layers of semiconductor material.. Commissariat Energie Atomique, March 24, 1993: EP0533551-A1 (132 worldwide citation)

Process for fabricating thin films of single-crystal or polycrystalline semiconductor material characterised in that it consists in subjecting a wafer of a semiconductor material including a flat surface to the following three steps: - a first step of implantation by bombarding (2) the surface (4) o ...


5
Fukuyo Fumitsugu, Fukumitsu Kenji, Uchiyama Naoki, Wakuta Toshimitsu: Laser beam machining method. Hamamatsu Photonics, July 10, 2002: JP2002-192370 (128 worldwide citation)

PROBLEM TO BE SOLVED: To provide a laser beam machining method capable of cutting a machining object without developing a crack, deviating from the predetermined line for welding or cutting on the surface of the machining object.SOLUTION: A pulse laser beam is radiated on a predetermined line 5 for ...


6
Reginald Lee: Row bar holder. Western Digital, March 20, 2012: US08136805 (123 worldwide citation)

A row bar holder to hold a plurality of row bars containing reader heads for scanning operations is disclosed. The row bar holder includes: a base fixture having a length defining a y-axis and a width defining an x-axis, a plurality of separator walls formed on a top surface of the base fixture spac ...


7
Michel Bruel: Process for manufacturing thin film layers of semiconductor material.. Commissariat Energie Atomique, March 19, 1993: FR2681472-A1 (114 worldwide citation)

Process for fabricating thin films of single-crystal or polycrystalline semiconductor material characterised in that it consists in subjecting a wafer of a semiconductor material including a flat surface to the following three steps: - a first step of implantation by bombarding (2) the surface (4) o ...


8
Phillip A Sollami: Cutting tool with hardened tip having a tapered base. The Sollami Company, Robert L Marsh, May 25, 2004: US06739327 (101 worldwide citation)

A cutting tool has a centrally located tungsten carbide insert brazed into a seat at the forward end of the tool. The seat has a circular mouth and rearward of the mouth is a frustoconical inner wall. At the bottom of the seat is a transverse surface. A tungsten carbide insert is brazed into the sea ...


9
Fletcher Ralph A, Oliver Joseph R: Apparatus for cutting rough-surfaced stone bodies. H E Fletcher Co, Hamilton Munroe H, May 7, 1974: US3809049 (98 worldwide citation)

Rough-surfaced blocks of stone are cut into a number of smaller pieces of a desired thickness by means of specially designed guillotine cutting apparatus in which isostatically held cutting elements are engaged against an upper side of a block and cooperate with a lower set of cutting elements of co ...


10
Phillip A Sollami: Tool mounting for a cutting tool. The Sollami Company, Robert L Marsh, November 30, 1999: US05992405 (96 worldwide citation)

A tool mounting block having a forward surface and a rearward surface and a cylindrical transverse aperture extending therethrough opening onto both the forward and rearward surfaces. The tool has a tapered forward cutting end, and axially aligned behind the forward cutting end is an annular flange. ...



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