1
Craig Allen
John Charles Smith, Mark Alan Etter, Brent Edward Stafford, James Timothy Stolzer, Craig Allen Carroll, Thomas O&apos Neal Walls: Hand-held oscillating spindle sander. Porter Cable Delta, Hunton & Williams, May 27, 2003: US06569002 (5 worldwide citation)

A hand-held oscillating spindle sander is disclosed. The sander includes a pair of toothed pulleys associated with the output shaft. The first pulley is attached to the output shaft for rotation with the output shaft. The second pulley is rotatably disposed on the output shaft for relative rotation ...


2
Ethan Simon
Mary Jo Kulp, Ethan Scott Simon: Multi-functional polishing pad. Rohm and Haas Electronic Materials CMP Holdings, Blake T Biederman, April 15, 2014: US08697239 (2 worldwide citation)

The polishing pad is suitable for polishing patterned semiconductor substrates containing at least one of copper, dielectric, barrier and tungsten. The polishing pad includes a polymeric matrix; and the polymeric matrix being a polyurethane reaction product of a polyol blend, a polyamine or polyamin ...


3
Ethan Simon
Mary Jo Kulp, Ethan S Simon, Darrell String: Chemical mechanical polishing pad having window with integral identification feature. Rohm and Haas Electronic Materials CMP Holdings, Thomas S Deibert, February 21, 2012: US08118641 (1 worldwide citation)

Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification feature is observable through the window, and wherein the integral identification feature identifies the ch ...


4

5
Shyam Venkataraman
LI Yuzhuo, VENKATARAMAN Shyam Sundar, PINDER Harvey Wayne: PROCÉDÉ DE POLISSAGE MÉCANO-CHIMIQUE DE SUBSTRATS CONTENANT DES FILMS DIÉLECTRIQUES DOXYDE DE SILICIUM ET DES FILMS DE POLYSILICIUM ET/OU DE NITRURE DE SILICIUM, PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS. BASF SE, LI Yuzhuo, VENKATARAMAN Shyam Sundar, PINDER Harvey Wayne, BASF, March 15, 2012: WO/2012/032467

CMP process for substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride films comprising the steps of (1 ) contacting the substrate with an aqueous composition containing (A) abrasive particles which are positively charged when dispersed in an aqueous medium havin ...


6
Ethan Simon
Mary Jo Kulp, Ethan S Simon, Darrell String: Chemical Mechanical Polishing Pad Having Window With Integral Identification Feature. Rohm And Haas Electronic Materials, Cmp Holdings, September 9, 2010: US20100227533-A1

Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification feature is observable through the window, and wherein the integral identification feature identifies the ch ...


7
Craig Allen
John Charles Smith, Mark Alan Etter, Brent Edward Stafford, James Timothy Stolzer, Craig Allen Carroll, Thomas O aposNeal Walls: Hand-held oscillating spindle sander. Christopher C Campbell, Hunton & Williams, January 24, 2002: US20020009951-A1

A hand-held oscillating spindle sander is disclosed. The sander includes a pair of toothed pulleys associated with the output shaft. The first pulley is attached to the output shaft for rotation with the output shaft. The second pulley is rotatably disposed on the output shaft for relative rotation ...


8

9

10


Click the thumbnails below to visualize the patent trend.