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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Conductive leads with non-wettable surfaces. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 30, 2002: US06378758 (18 worldwide citation)

A microelectronic connection component is provided with leads having a surface wettable by a bonding material such as a solder at the tips of the leads which are intended to be bonded with microelectronic devices. The leads have non-wettable surfaces bounding the wettable surfaces. During bonding, t ...


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Belgacem Haba Belgacem (Bel) Haba
Bruce M McWilliams, Belgacem Haba, Giles Humpston: Solder elements with columnar structures and methods of making the same. Tessera, Tessera, LERNER DAVID et al, February 14, 2008: US20080036100-A1

Elongated solder masses are formed by contacting the molten solder with the walls of holes in a dielectric layer overlying the front face of a chip element such as a wafer. The elongated solder masses have a relatively large aspect ratio, or ratio of height to maximum diameter, and thus provide a hi ...


3
Nathaniel Brese
Nathaniel E Brese, Michael P Toben: Electronic devices and methods of forming electronic devices. Rohm and Haas Electronic Materials, Edwards & Angell, June 30, 2005: US20050139644-A1

Disclosed are methods of forming an electronic device. The methods involve (a) providing a substrate and a component to be bonded to the substrate, wherein the component is chosen from an electronic component, an optical component, a device lid, and a combination thereof; (b) applying solder paste t ...


4
Nathaniel Brese
Nathaniel E Brese, Michael P Toben: Methods of forming solder areas on electronic components and electronic components having solder areas. Rohm and Haas Electronic Materials, Edwards & Angell, June 23, 2005: US20050133572-A1

Disclosed are methods of forming solder areas on electronic components. The methods involve: (a) providing a substrate having one or more contact pads; and (b) applying a solder paste over the contact pads. The solder paste includes a carrier vehicle and a metal component having metal particles. The ...


5
Rick Lake
Rick C Lake, Ross S Dando: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, Perkins Coie, December 7, 2010: US07845540

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...


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Igor Y Khandros: Method of manufacturing electrical contacts, using a sacrificial member. Form Factor, Gerald E Linden, December 19, 1995: US05476211 (317 worldwide citation)

A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensional ...


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Francis LoVasco, Michael A Oien: Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate. American Telephone and Telegraph Company AT&T Bell Laboratories, Alfred G Steinmetz, November 7, 1989: US04878611 (218 worldwide citation)

A solder joint assembly technique applies controlled volumes of solder to pads of both package and substrate. The two units are positioned adjacent each other with the pads and solder deposits mechanically maintained in registration with each other. The assembly is reflowed and the final separation ...


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Geoffrey C Herrick: Method of securing metallic members together. Tektronix, Francis I Gray, March 1, 1988: US04727633 (177 worldwide citation)

Two metallic members are connected together over a defined area of respective surfaces of the members by providing at least one layer of metal on at least one of the surfaces. The or each layer of metal has at least one elementary component and is of essentially uniform composition over the defined ...


9
George C Correia, John E Cronin, Edmund J Sprogis: Stacked chip process carrier. International Business Machines Corporation, Robert A Walsh Esq, Scully Scott Murphy & Presser, August 28, 2001: US06279815 (168 worldwide citation)

The present invention provides an apparatus and methods for holding a first semiconductor device in proper alignment to a second semiconductor device, whose size is different from the first device, while performing a C4 bond between the two devices. The apparatus for holding the two devices in prope ...


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