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Katsuyuki Musaka
Natsuki Makino, Junji Kunisawa, Keisuke Namiki, Yukio Fukunaga, Katsuyuki Musaka, Ray Fang, Emanuel Israel Cooper, John Michael Cotte, Hariklia Deligianni, Keith T Kwietniak, Brett C Baker O Neal, Matteo Flotta, Philippe Mark Vereecken: Electrolytic processing apparatus and method. Squire Sanders & Dempsey, February 15, 2007: US20070034526-A1

An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface ...


2
Katsuyuki Musaka
Masayuki Kumekawa, Norio Kimura, Yukio Fukunaga, Katsuyuki Musaka, Hariklia Deligianni, Emanuel Israel Cooper, Philippe Mark Vereecken: Electrolytic processing method. Squire Sanders & Dempsey, February 15, 2007: US20070034525-A1

An electrolytic processing method is used to remove a metal film formed on a surface of a substrate. The electrolytic processing method includes providing a feeding electrode 31 and a processing electrode 32 on a table 12, providing an insulating member 36 between the feeding electrode and the proce ...


3
Andersson Matts, Carlsson Lennart, Isberg Erik: A procedure and apparatus for producing individually designed, three-dimensional bodies usable as tooth replacements, prostheses, etc.. Nobelpharma, June 17, 1992: EP0490848-A2 (167 worldwide citation)

A procedure for producing individually designed, three-dimensional bodies includes as part steps the identification of one or more shapes/forms (10) of one or more of said bodies (9). A first digital representation is formed by each respective identification. Respective representation is stored and ...


4
Akira Koshiishi, Jun Ooyabu: Plasma processing system. Tokyo Electron, Smith Gambrell & Russell, June 6, 2000: US06072147 (113 worldwide citation)

A plasma processing system capable of carrying out a uniform processing is provided.


5
Stuart L Roberts, Rich Fogal: Wire bonders and methods of wire-bonding. Micron Technology, Perkins Coie, June 5, 2007: US07227095 (93 worldwide citation)

Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and se ...


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Stuart L Roberts, Rich Fogal: Wire bonders and methods of wire-bonding. Micron Technology, Perkins Coie, July 12, 2011: US07977597 (76 worldwide citation)

Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and se ...


8
Latanision Ronald M: Machining method. Martin Marietta Corporation, Crowley Jr John A, Eisel James B, March 25, 1975: US3873512 (65 worldwide citation)

A method of machining a metallic workpiece with a worktool by passing an electrolyte in contact with the workpiece; immersing an auxiliary electrode in said electrolyte; providing a reference electrode; applying an electrical potential to the workpiece, in relation to the reference electrode, suffic ...


9
Shinya Kiyobumi, Katsura Isao, Onishi Mamoru: Method for manufacturing honeycomb object molding die. Denso, September 4, 2008: JP2008-200821 (63 worldwide citation)

PROBLEM TO BE SOLVED: To provide a method for manufacturing a honeycomb object, which can inhibit deformation during discharge machining and is excellent in accuracy of groove working.SOLUTION: The method is used for manufacturing a honeycomb object molding die 1 having a supply hole for supplying a ...


10
Ismail Emesh, Saket Chadda, Nikolay N Korovin, Brian L Mueller: Method and apparatus for electrochemical planarization of a workpiece. SpeedFam IPEC Corporation, Snell & Wilmer L, May 18, 2004: US06736952 (63 worldwide citation)

An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a pla ...