1
Leo M Higgins III: Area array semiconductor device having a lid with functional contacts. Motorola, Minh Hien N Clark, March 1, 1994: US05291062 (168 worldwide citation)

An area array semiconductor device (10) having a lid with functional I/O contacts can be manufactured. In one embodiment, a semiconductor die (12) is mounted in a die cavity (16) of a substrate (14). A plurality of wire bonds (20) connect the die to conductive traces (18) on a surface of the substra ...


2
Klaus Bansemir, Karlheinz Disch, Klaus Hachmann, Rudolf Lehmann, Manfred Biermann, Harald Schnegelberger: Disinfectants and their use for disinfecting the skin and mucous membrane. Henkel Kommanditgesellschaft auf Aktien, Ernest G Szoke, Wayne C Jaeschke, Real J Grandmaison, February 13, 1990: US04900721 (134 worldwide citation)

Liquid, aqueous disinfectants based on alcohol and hydrogen peroxide which contain one or more C.sub.2 -C.sub.8 alcohols, hydrogen peroxide or a compound which forms peroxide in aqueous phase, one or more carboxylic acids, one or more microbicidally active nitrogen-containing organic compounds, one ...


3
Jun Yamauchi, Nobutoshi Aoki: Semiconductor device and manufacturing method of the same. Kabushiki Kaisha Toshiba, Oblon Spivak McClelland Maier & Neustadt P C, August 16, 2005: US06930360 (112 worldwide citation)

A semiconductor device having a semiconductor layer, includes: a first impurity atom having a covalent bond radius larger than a minimum radius of a covalent bond of a semiconductor constituent atom of a semiconductor layer; and a second impurity atom having a covalent bond radius smaller than a max ...


4
Timothy J Bender, David D Flamme: Multiple-type seed dispensing system. Case Corporation, Foley & Lardner, June 29, 1999: US05915313 (73 worldwide citation)

A system for dispensing multiple types of seed as a planting apparatus (planter or drill) travels throughout an agricultural field is disclosed herein. The planting apparatus is typically an implement having row units for applying seed to the field as the implement is pulled by a vehicle (tractor). ...


5
Brian S Doyle: Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer. Intel Corporation, Blakely Sokoloff Taylor & Zafman, April 25, 2000: US06054370 (65 worldwide citation)

A method of fabricating a film of active devices is provided. First damaged regions are formed, in a substrate, underneath first areas of the substrate where active devices are to be formed. Active devices are formed onto the first areas. Second damaged regions are formed, in the substrate, between ...


6
Daniel E Meyer, John E Riedel: Elastomeric adhesive and cohesive materials. Minnesota Mining and Manufacturing Company, Gary L Griswold, Walter N Kirn, Thomas E Jurgensen, July 27, 1993: US05230701 (64 worldwide citation)

A nonwoven elastomeric web is provided. The web comprises thermoplastic elastomeric melt-blown small diameter fibers having a diameter of less than about 50 microns, the small diameter fibers being randomly arrayed and bonded at points of contact such that the tensile strength of the web in the dire ...


7
Malcolm H Alexander: No-till field implement. Joseph W Holloway, June 5, 1990: US04930431 (50 worldwide citation)

An implement for agricultural field work is primarily useful for preparing a field for no-till planting and comprises a wheel carried frame for carrying a massive fertilizer hopper which has apertures in its bottom portion through which fertilizer flows at a metered rate into feed tubes which carry ...


8
Igor Y Khandros, Thomas H DiStefano: Semiconductor chip assembly with anisotropic conductive adhesive connections. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 21, 2002: US06392306 (47 worldwide citation)

A semiconductor chip assembly including a semiconductor chip having contacts on a front surface, an element having terminals thereon and leads connecting the contacts to the terminals, wherein the leads are connected to the chip contacts by Z-conductive adhesive connections. In a preferred embodimen ...


9
Alvin E McQuinn: Multi-variable rate dispensing system for agricultural machine. Chem Equipment Co, Kinney & Lange, September 19, 2000: US06122581 (43 worldwide citation)

An improved mobile agricultural products application system including a multi-variable rate dispensing system particularly adaptable for use in site-specific farming, wherein selected discrete crop input delivery information unique to selected on-board crop input storage devices, and/or crop input t ...


10
Kazumi Higashi, Amane Mochizuki, Masako Maeda: Anisotropic electrically conductive adhesive film and connection structure using the same. Nitto Denko Corporation, Sughrue Mion Zinn Macpeak & Seas, August 1, 1995: US05438223 (43 worldwide citation)

An anisotropic electrically conductive adhesive film having fine through holes independently electroconductively passing through an insulating film in the thickness direction, at least one end portion of both the end portions of the each through hole on the front and back surfaces of said film being ...



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