1
Chan Hoon Ko, Soo San Park, YoungChul Kim: Integrated circuit packaging system having dual sided connection and method of manufacture thereof. Stats Chippac, Mikio Ishimaru, April 12, 2011: US07923290 (13 worldwide citation)

A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through ...


2
Baekyu Kim, Kyungha Kim, Talchol Kim, Heera Lee, Youngchul Kim, Yeonho Kim, Jaeshin Yi, Wansoo Kim: Transmission for hybrid vehicle. Hyundai Motor Company, Edwards Wildman Palmer, Peter F Corless, November 20, 2012: US08313401 (5 worldwide citation)

The transmissions for a hybrid vehicle according to the present invention provide multiple electric vehicle modes, multiple power split modes, and multiple fixed-gear ratio modes, thereby increasing driving performance and fuel efficiency.


3
Jae Hak Yee, Junwoo Myung, Byoung Wook Jang, YoungChul Kim: Inline integrated circuit system. STATS ChipPAC, Mikio Ishimaru, June 28, 2011: US07968981 (5 worldwide citation)

An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.


4
JoungIn Yang, ChoongBin Yim, KeonTeak Kang, YoungChul Kim: Stackable package by using internal stacking modules. STATS ChipPAC, Robert D Atkins, September 21, 2010: US07800211 (4 worldwide citation)

A semiconductor package has a substrate with solder balls. A first semiconductor die is disposed on the substrate. A first double side mold (DSM) internal stackable module (ISM) is in physical contact with the first semiconductor die through a first adhesive, such as a film on wire adhesive. A secon ...


5
Jae Hak Yee, Junwoo Myung, Byoung Wook Jang, YoungChul Kim: Method for manufacture of inline integrated circuit system. Stats Chippac, Ishimaru & Associates, I Chang John Yang, August 6, 2013: US08501540 (2 worldwide citation)

A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.


6
KyungMoon Kim, YoungChul Kim, HunTeak Lee, KeonTaek Kang, HeeJo Chi: Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding. STATS ChipPAC, Robert D Atkins, Patent Law Group Atkins and Associates P C, February 2, 2016: US09252130 (2 worldwide citation)

Methods of producing a semiconductor package using dual-sided thermal compression bonding includes providing a substrate having an upper surface and a lower surface. A first device having a first surface and a second surface can be provided along with a second device having a third surface and a fou ...


7
YoungChul Kim, KyungHoon Lee, Seong Won Park, Ki Youn Jang, JaeHyun Lee, DeokKyung Yang, In Sang Yoon, SungEun Park: Integrated circuit packaging system with connection structure and method of manufacture thereof. STATS ChipPAC, Ishimaru & Associates, December 1, 2015: US09202715 (1 worldwide citation)

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die sur ...


8
KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan Hoang, Pandi C Marimuthu, Steve Anderson, HunTeak Lee, HeeJo Chi: Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form. STATS ChipPAC, Robert D Atkins, Atkins and Associates P C, March 15, 2016: US09287204 (1 worldwide citation)

A semiconductor device has a plurality of semiconductor die disposed over a carrier. An electrical interconnect, such as a stud bump, is formed over the semiconductor die. The stud bumps are trimmed to a uniform height. A substrate includes a bump over the substrate. The electrical interconnect of t ...


9
Chan Hoon Ko, Soo San Park, YoungChul Kim: Integrated circuit packaging system having dual sided connection and method of manufacture thereof. STATS ChipPAC, Ishimaru & Associates, December 9, 2014: US08906740 (1 worldwide citation)

A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through ...


10
Youngchul Kim, Gwangseob Shin, Jonghyun Kim, Yeonho Kim, Jaeshin Yi: Hydraulic control system of power train for hybrid vehicle. Hyundai Motor Company, Kia Motors Corporation, Morgan Lewis & Bockius, March 26, 2013: US08403787 (1 worldwide citation)

The present invention provides a hydraulic control system of a power train for a hybrid vehicle that allows the power train of a hybrid vehicle to implement all of two or more EV modes, two or more power split modes, and at least three or more fixed-stage modes, with a relatively simple configuratio ...