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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 12, 2006: US07149095 (41 worldwide citation)

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 9, 2008: US07462936 (32 worldwide citation)

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 19, 2010: US07816251 (2 worldwide citation)

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Methods of making microelectronic assemblies including folded substrates. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2003: US20030168725-A1 (1 worldwide citation)

A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Tessera, LERNER DAVID et al, March 19, 2009: US20090071000-A1

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


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Belgacem Haba Belgacem (Bel) Haba
Vernon Solberg, Pieter H Bellaar, Young Gon Kim, Belgacem Haba: Stacked microelectronic assemblies having basal compliant layers. Tessera, Tessera, LERNER DAVID et al, December 21, 2006: US20060286717-A1

A method of making a stacked microelectronic assembly includes providing a flexible substrate having first and second ends, the flexible substrate having a plurality of attachment sites located between the first and second ends thereof including a first one of the attachment sites located adjacent t ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Young Gon Kim, David B Tuckerman: Formation of circuitry with modification of feature height. Tessera, Lerner David Litenberg Krumholz & Mentlik, June 2, 2005: US20050116326-A1

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.


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L Elliott Pflughaupt, David Gibson, Young Gon Kim, Craig S Mitchell, Wael Zohni, Ilyas Mohammed: Stacked packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 20, 2005: US06977440 (90 worldwide citation)

A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces whic ...


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Kyong Mo Bang, David Gibson, Young Gon Kim, John B Riley: Components, methods and assemblies for stacked packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 13, 2007: US07294928 (78 worldwide citation)

A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to ...


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L Elliott Pflughaupt, David Gibson, Young Gon Kim, Craig S Mitchell: Stacked packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 24, 2005: US06897565 (40 worldwide citation)

A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces whic ...



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