1
Yota Shiro, Kubota Yoshihiro, Tsuji Kazuto: Heat dissipation structure of electronic component and semiconductor device. Fujitsu, October 2, 2008: JP2008-235576 (9 worldwide citation)

PROBLEM TO BE SOLVED: To provide a versatile heat dissipation structure of electronic components of improved heat dissipation characteristics, as well as a semiconductor device.SOLUTION: Relating to the heat dissipation structure of an electronic component 35 that is mounted on a wiring substrate 31 ...


2
Takenaka Masaji, Yota Shiro, Hiyoshi Junichiro: Semiconductor device and substrate for semiconductor device. Fujitsu, October 12, 2001: JP2001-284413 (3 worldwide citation)

PROBLEM TO BE SOLVED: To provide a semiconductor device having a resin filled between a semiconductor element and a substrate, to which the resin can be surely applied by a conventional casting method as well with no development of a void, steady quality, and high yield, and to provide a substrate f ...


3
Takenaka Masaji, Yota Shiro, Hiyoshi Junichiro, Takahashi Hiroshi, Sato Hideo: Semiconductor device. Fujitsu, November 2, 2000: JP2000-306958 (2 worldwide citation)

PROBLEM TO BE SOLVED: To realize a highly reliable semiconductor device free of cracks and breaks, in a semiconductor device having a structure such that a semiconductor chip is arranged on a TAB (tape automated bonding) tape. SOLUTION: A semiconductor device 20A has a wiring pattern 28 and a TAB ta ...


4
Takenaka Masaji, Yota Shiro, Kikuchi Satoshi, Sato Hideo, Matsubayashi Hidekazu: Semiconductor element and multi-chip package. Fujitsu, August 12, 2004: JP2004-228142 (1 worldwide citation)

PROBLEM TO BE SOLVED: To solve problems, wherein at the time of constituting a multi-chip device having new functions by combining a plurality of semiconductor elements having different functions, an area increases when the wire bonding or flip-chip bonding with a mounted substrate is executed by al ...


5
Takenaka Masaji, Yota Shiro, Hiyoshi Junichiro, Takahashi Hiroshi, Sato Hideo: Tape carrier package. Fujitsu, January 1, 2001: TW417218

A tape carrier package formed by a TAB technique is provided. This tape carrier package includes a semiconductor chip and a TAB tape. The TAB tape has a rectangular device hole in which the semiconductor chip is situated, and inner leads extending inward in the device hole and bonded to the electrod ...


6
Kubota Yoshihiro, Yota Shiro, Tsuji Kazuto: Package, manufacturing method thereof, semiconductor device using the same, and manufacturing method of semiconductor device using the same. Fujitsu, August 7, 2008: JP2008-181977

PROBLEM TO BE SOLVED: To provide a package structure, along with a semiconductor device, capable of preventing disconnection of a surface layer wiring, relating to a manufacturing process.SOLUTION: There are provided a substrate 2 which is enclosed with a first side 12A, bored before a mounting proc ...


7
Takenaka Masaji, Yota Shiro, Hiyoshi Junichiro, Takahashi Hiroshi, Sato Hideo: Tape carrier package. Fujitsu, June 6, 2000: JP2000-156389

PROBLEM TO BE SOLVED: To surely prevent deformation of leads and generation of disconnection when stress is applied to the inner leads in the course of transfer or the like, regarding a tape carrier package using a TAB(tape automated bonding) technique.SOLUTION: A tape carrier package is provided wi ...


8
Miyaji Naoki, Yota Shiro: Connecting structure for semiconductor device. Fujitsu, July 15, 1997: JP1997-186192

PROBLEM TO BE SOLVED: To improve the mounting efficiency of a semiconductor device and to reduce the cost in the connecting structure of the device in which the device of a drive IC is connected to an element to be connected such as a liquid crystal panel by using a carrier tape. SOLUTION: In the co ...


9
Moriya Susumu, Fukazawa Norio, Yota Shiro: Semiconductor device. Fujitsu, August 21, 1998: JP1998-223688

PROBLEM TO BE SOLVED: To enable a stable mounting, by forming an insulation substrate on a chip to connect it to conductive means through a conductive pattern formed thereon, thereby forming electrodes round the chip over the entire chip surface and setting the spacing of the conductive means than t ...


10
Takenaka Masaji, Yota Shiro, Kikuchi Satoshi, Sato Hideo, Matsubayashi Hidekazu: Semiconductor device and its manufacturing method. Fujitsu, October 28, 2004: JP2004-304077

PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method in which in a semiconductor package in which an external terminal is electrically connected to a semiconductor chip by an inner lead on an insulating film face, it is intended to prevent a short-circuit between the ...



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