1
Tetsuya Fujisawa, Mitsutaka Sato, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki, Masaki Waki, Toshio Hamano, Katsuhiro Hayashida, Yoshitsugu Katoh, Hiroshi Inoue: Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism. Fujitsu, Armstrong Westerman & Hattori, August 13, 2002: US06433418 (116 worldwide citation)

A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outsid ...


2
Mitsuo Abe, Yoshihiro Kubota, Yoshitsugu Katoh, Michio Hayakawa, Ryuji Nomoto, Mitsutaka Sato, Seiichi Orimo, Hiroshi Inoue, Toshio Hamano: Semiconductor device and method of producing the same. Fujitsu, Armstrong Westerman Hattori Mcleland & Naughton, September 11, 2001: US06288444 (52 worldwide citation)

A semiconductor device and a method of producing the semiconductor device are provided. This semiconductor device includes a semiconductor chip, a printed wiring board, a heat spreader, a sealing resin, and solder balls. The printed wiring board is provided with the solder balls on an outer portion ...


3
Yoshitsugu Katoh, Mitsutaka Sato, Hiroshi Inoue, Seiichi Orimo, Akira Okada, Yoshihiro Kubota, Mitsuo Abe, Toshio Hamano, Yoshitaka Aiba, Tetsuya Fujisawa, Masaaki Seki, Noriaki Shiba: Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, December 25, 2001: US06333564 (32 worldwide citation)

A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chi ...


4
Yoshitsugu Katoh, Mitsuo Abe, Yoshihiko Ikemoto, Sumikazu Hosoyamada: Method for making semiconductor device. Fujitsu, Westerman Hattori Daniels & Adrian, September 28, 2004: US06796024 (13 worldwide citation)

According to the method of producing a semiconductor device, the substrate is provided with an opening formed at a substantially central position, interconnections and joining parts. The heat spreading plate has a fixed portion fixed to the substrate, a stage portion caved with respect to the fixed ...


5
Yoshitsugu Katoh, Mitsuo Abe, Yoshihiko Ikemoto, Sumikazu Hosoyamada: Semiconductor device having a heat spreading plate. Fujitsu, Armstrong Westerman & Hattori, May 6, 2003: US06559536 (13 worldwide citation)

A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a first surface and electrically connects the sem ...


6
Yoshihiko Ikemoto, Mitsuo Abe, Yoshitsugu Katoh, Sumikazu Hosoyamada: Semiconductor device having a power supply ring and a ground ring. Fujitsu, Armstrong Westerman & Hattori, July 23, 2002: US06424032 (7 worldwide citation)

In a semiconductor device, an influence of the simultaneous switching noise is reduced by increasing the decoupling capacity between a ground ring and a power supply ring. A semiconductor element having a plurality of electrode pads is mounted on a redistribution substrate. The power supply ring and ...


7
Yoshitsugu Katoh, Tetsuya Fujisawa, Mitsutaka Sato, Eiji Yoshida: Semiconductor device and method for fabricating the same. Fujitsu Microelectronics, Fujitsu Patent Center, April 6, 2010: US07692294

A semiconductor device with a structure having superior heat sink characteristics. A first heat sink member is located over a wiring board by using an adhesive material. A semiconductor element is stuck over the first heat sink member by using an adhesive material. The semiconductor element and elec ...


8
Futoshi Fukaya, Yoshitsugu Katoh: Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method. Fujitsu Microelectronics, Fujitsu Patent Center, March 23, 2010: US07682140

A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging furthe ...


9
Yoshitsugu Katoh, Shinya Nakaseko, Takashi Hozumi: Semiconductor device keeping structural integrity under heat-generated stress. Armstrong Westerman Hattori Mcleland & Naughton, November 29, 2001: US20010045643-A1

A semiconductor device includes an elastic member which has an adhesive contact with at least one other member. The adhesive contact forces said elastic member to stay in a deformed shape different from an original shape to which said elastic member tries to return, wherein a force generated by said ...


10
Yoshitsugu Katoh, Mitsuo Abe, Yoshihiko Ikemoto, Sumikazu Hosoyamada: Semiconductor device and method of producing the same. Fujitsu, Armstrong Westerman & Hattori, August 28, 2003: US20030161112-A1

A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a first surface and electrically connects the sem ...