1
Kazuyuki Imamura, Yasunori Fujimoto, Masaaki Seki, Tetsuya Fujisawa, Mitsutaka Sato, Ryuji Nomoto, Junichi Kasai, Yoshitaka Aiba, Noriaki Shiba: Semiconductor device having columnar electrode and method of manufacturing same. Fujitsu, Armstrong Westerman & Hattori, November 5, 2002: US06476503 (124 worldwide citation)

A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. So ...


2
Hirohisa Matsuki, Yutaka Makino, Masamitsu Ikumo, Mitsutaka Sato, Tetsuya Fujisawa, Yoshitaka Aiba: External connection terminal and semiconductor device. Fujitsu, Armstrong Westerman & Hattori, April 15, 2003: US06548898 (46 worldwide citation)

A structure in which a phosphorus-nickel layer, a rich phosphorus nickel layer that contains phosphorus or boron higher than this phosphorus-nickel layer, a nickel-tin ally layer, a tin-rich tin alloy layer, and a tin alloy solder layer are formed in sequence on an electrode. Accordingly, adhesivene ...


3
Hirohisa Matsuki, Yoshitaka Aiba, Mitsutaka Sato, Tadahiro Okamato: Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same. Fujitsu, Westerman Hattori Daniels & Adrian, August 1, 2006: US07084513 (43 worldwide citation)

A semiconductor device includes a first semiconductor chip (5) having a first terminal (7) on one surface, a second semiconductor chip (1a) which is larger than the first semiconductor chip (5) and on which the first semiconductor chip (5) is stacked and which has a second terminal (3) on one surfac ...


4
Yoshitaka Aiba, Ryuji Nomoto: Semiconductor device and method of manufacturing the semiconductor device. Fujitsu, Westerman Hattori Daniels & Adrian, October 17, 2006: US07122897 (41 worldwide citation)

A semiconductor device comprises a semiconductor chip, a wiring layer formed on the semiconductor chip, a column electrode connected at a first end to the wiring layer, and an encapsulation resin formed on the semiconductor chip. In the semiconductor device, the column electrode is provided with a s ...


5
Yoshitaka Aiba, Ryuji Nomoto: Semiconductor device and method of manufacturing the semiconductor device. Fujitsu, Westerman Hattori Daniels & Adrian, November 25, 2008: US07456089 (38 worldwide citation)

A semiconductor device comprises a semiconductor chip, a wiring layer formed on the semiconductor chip, a column electrode connected at a first end to the wiring layer, and an encapsulation resin formed on the semiconductor chip. In the semiconductor device, the column electrode is provided with a s ...


6
Yoshitaka Aiba, Mitsutaka Sato, Toshio Hamano: Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, February 19, 2002: US06348728 (38 worldwide citation)

A plurality of semiconductor chips are incorporated in a one-piece package so as to substantially increase a mounting area of a semiconductor device so that the semiconductor device can be provided with the projection electrodes having a structure which enable the semiconductor device to be mounted ...


7
Yoshitsugu Katoh, Mitsutaka Sato, Hiroshi Inoue, Seiichi Orimo, Akira Okada, Yoshihiro Kubota, Mitsuo Abe, Toshio Hamano, Yoshitaka Aiba, Tetsuya Fujisawa, Masaaki Seki, Noriaki Shiba: Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, December 25, 2001: US06333564 (31 worldwide citation)

A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chi ...


8
Tetsuya Fujisawa, Hirohisa Matsuki, Osamu Igawa, Yoshitaka Aiba, Masamitsu Ikumo, Mitsutaka Sato: Semiconductor device configured to be surface mountable. Fujitsu, Westerman Hattori Daniels & Adrian, December 28, 2004: US06836025 (30 worldwide citation)

In a semiconductor device circuit formation surfaces of each of a plurality of semiconductor chips can be easily located at even level when the semiconductor chips are arranged side by side so that a process of forming rearrangement wiring is simplified. The semiconductor chips are mounted on a subs ...


9
Hirohisa Matsuki, Yutaka Makino, Masamitsu Ikumo, Mitsutaka Sato, Tetsuya Fujisawa, Yoshitaka Aiba: External connection terminal and semiconductor device. Fujitsu, Armstrong Kratz Quintos Hanson & Brooks, August 31, 2004: US06784543 (14 worldwide citation)

A structure in which a phosphorus-nickel layer, a rich phosphorus nickel layer that contains phosphorus or boron higher than this phosphorus-nickel layer, a nickel-tin ally layer, a tin-rich tin alloy layer, and a tin alloy solder layer are formed in sequence on an electrode. Accordingly, adhesivene ...


10
Yoshitaka Aiba, Hirohisa Matsuki, Mitsutaka Sato: Light signal processing system. Fujitsu, Westerman Hattori Daniels & Adrian, June 21, 2005: US06909181 (12 worldwide citation)

There are provided a sealing insulating film that is formed on a substrate and melted at a first heating temperature to have a flowability, and external terminals that are formed on the substrate, and connected to other electronic device at a second heating temperature higher than the first heating ...