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Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yoshikatsu Mikami, Kuniteru Muto, Yoshiyuki Ikezoe: Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained. Hitachi Chemical Company, Antonelli Terry & Wands, April 26, 1988: US04740657 (112 worldwide citation)

Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insul ...


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Isao Tsukagoshi, Hiroshi Matsuoka, Yukihisa Hirosawa, Yoshikatsu Mikami, Hisashi Dokochi: Semiconductor device having a semiconductor chip electrically connected to a wiring substrate. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, September 8, 1998: US05804882 (46 worldwide citation)

A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as su ...


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Shun ichi Numata, Koji Fujisaki, Noriyuki Kinjo, Junichi Imaizumi, Yoshikatsu Mikami: Low thermal expansion resin material and composite shaped article. Hitachi, Hitachi Chemical, Antonelli Terry & Wands, September 1, 1987: US04690999 (29 worldwide citation)

A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and ca ...


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Shun ichi Numata, Koji Fujisaki, Noriyuki Kinjo, Junichi Imaizumi, Yoshikatsu Mikami: Low thermal expansion resin material and composite shaped article. Hitachi, Hitachi Chemical Co, Antonelli Terry & Wands, December 20, 1988: US04792476 (23 worldwide citation)

A resin material comprising a polyamide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and ca ...


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Hideji Kuwajima, Shozo Yamana, Junichi Kikuchi, Hisashi Dokochi, Toshikazu Ono, Yoshikatsu Mikami, Hiroshi Wada: Composite electroconductive powder, electroconductive paste, process for producing electroconductive paste, electric circuit and process for producing electric circuit. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, September 14, 1999: US05951918 (22 worldwide citation)

An electroconductive paste for forming an electric circuit which is low in resistivity, high in electroconductivity and minimized in change of resistivity even after a thermal shock test and/or a humidity and DC applied test, can be obtained by using a composite electroconductive powder comprising a ...


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Mitsuo Usami, Kunihiko Nishi, Yoshikatsu Mikami, Masakatsu Suzuki: Semiconductor integrated circuit card assembly. Hitachi, Hitachi Chemical Company, Dickstein Shapiro Morin & Oshinsky, December 26, 2000: US06166911 (10 worldwide citation)

Provided is a semiconductor assembly, comprising a circuit board (1) including a conductor circuit (4), the conductor circuit including connecting pads, a semiconductor chip (2) provided with connecting terminals provided on a first surface thereof, and mounted on the circuit board, a casing (5) cov ...


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