1
Masayuki Watanabe, Toshio Sugano, Seiichiro Tsukui, Takashi Ono, Yoshiaki Wakashima: Semiconductor integrated circuit device and method of manufacturing the same. Hitachi, Hitachi Tobu Semiconductor, Akita Electronics, Pennie & Edmonds, January 1, 1991: US04982265 (350 worldwide citation)

In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat ...


2
Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura: Semiconductor stacked device. Hitachi, Hitachi Tobu Semiconductor, Antonelli Terry Stout & Kraus, March 30, 1993: US05198888 (173 worldwide citation)

There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and ...


3
Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura: Stacked semiconductor memory device and semiconductor memory module containing the same. Hitachi, Hitachi Tobu Semiconductor, Antonelli Terry Stout & Kraus, August 2, 1994: US05334875 (62 worldwide citation)

There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and ...


4
Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura: Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices. Hitachi, HitachiTobu Semiconductor, Antonelli Terry Stout & Kraus, July 2, 1991: US05028986 (61 worldwide citation)

There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and ...


5
Masayuki Watanabe, Toshio Sugano, Seiichiro Tsukui, Takashi Ono, Yoshiaki Wakashima: Semiconductor memory module having double-sided stacked memory chip layout. Hitachi, Hitachi Tobu Semiconductor, Akita Electronics, Pennie & Edmonds, June 8, 1999: US05910685 (52 worldwide citation)

In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat ...


6
Naoki Fukutomi, Yoshiaki Wakashima, Susumu Naoyuki, Akinari Kida: Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device. Hitachi Chemical, Pennie & Edmonds, July 31, 2001: US06268648 (37 worldwide citation)

A semiconductor device comprising a substrate with a cavity portion for mounting a semiconductor chip is provided to achieve a high reliability and to decrease a size and a fabricating cost. The cavity portion capable of mounting the semiconductor chip (


7
Hideya Ohtani, Toshimitsu Momoi, Eiji Ooi, Shuhei Sakuraba, Masayuki Morita, Yoshiaki Wakashima: Semiconductor device and tape carrier. Hitachi, Antonelli Terry Stout & Kraus, December 11, 1990: US04977441 (32 worldwide citation)

According to the present invention, a tape carrier is prepared which comprises a power trunk line including an electric connection as a branch of a power lead for each tape carrier unit and a ground trunk line having an electric connection as a branch of a ground lead for each tape carrier unit, the ...


8
Hideya Ohtani, Toshimitsu Momoi, Eiji Ooi, Shuhei Sakuraba, Masayuki Morita, Yoshiaki Wakashima: Semiconductor device and process for producing the same, and tape carrier used in said process. Hitachi, Antonelli Terry & Wands, December 20, 1988: US04792532 (27 worldwide citation)

According to the present invention, a tape carrier is prepared which comprises a power trunk line including an electric connection as a branch of a power lead for each tape carrier unit and a ground trunk line having an electric connection as a branch of a ground lead for each tape carrier unit, the ...


9
Takashi Yokoyama, Yasuo Miyadera, Nobuhiko Shito, Hiroshi Suzuki, Yoshiaki Wakashima: Method of making a semiconductor device. Hitachi, Beall & Jeffery, December 20, 1977: US04064289 (26 worldwide citation)

Method of making a semiconductor device which includes applying a solution of a heterocyclic ring-containing polymer in an organic solvent to a desired surface of a semiconductor body and removing the organic solvent from the solution by heat thereby to form a coating of a polymer on the surface, wh ...


10
Yoshiaki Wakashima: Method of fabricating a resin mold type semiconductor device. Antonelli Terry & Wands, June 18, 1985: US04523371 (18 worldwide citation)

A resin mold type semiconductor device comprising molded articles for sealing, each consisting of a resin material and having a gap portion thereinside; a semiconductor element positioned in said gap portion inside said molded article for sealing, said seminconductor element having electrodes; elect ...