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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2012: US08329581 (35 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 18, 2008: US07453157 (33 worldwide citation)

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelect ...


3
Belgacem Haba Belgacem (Bel) Haba
Yoichi Kubota, Teck Gyu Kang, Jae M Park, Belgacem Haba: Components with posts and pads. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 24, 2009: US07495179 (17 worldwide citation)

A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectonic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 29, 2010: US07745943 (16 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 13, 2007: US07176043 (16 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away f ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Yoichi Kubota: Manufacture of mountable capped chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 13, 2010: US07754537 (14 worldwide citation)

A wafer or a portion of a wafer including capped chips such as surface acoustic wave (SAW) chips is provided with terminals by applying a terminal-bearing element such as a dielectric element with terminals and leads thereon, or a lead frame, so that the terminal-bearing element covers the caps, and ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Yoichi Kubota: Manufacture of mountable capped chips. Tessera, Lerner David Litenberg Krumholz & Mentlik, December 9, 2008: US07462932 (11 worldwide citation)

A wafer or a portion of a wafer including capped chips such as surface acoustic wave (SAW) chips is provided with terminals by applying a terminal-bearing element such as a dielectric element with terminals and leads thereon, or a lead frame, so that the terminal-bearing element covers the caps, and ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Yoichi Kubota, Teck Gyu Kang, Jae M Park: Fine pitch microcontacts and method for forming thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 4, 2014: US08641913 (8 worldwide citation)

A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the su ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 30, 2009: US07554206 (4 worldwide citation)

A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting ...


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Belgacem Haba Belgacem (Bel) Haba
Yoichi Kubota, Teck Gyu Kang, Jae M Park, Belgacem Haba: Method of making a connection component with posts and pads. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 1, 2011: US08046912 (3 worldwide citation)

A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of ...



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