Yamamoto Kazuhiko C O Nitto de, Yamamoto Hiraku C O Nitto Denk, Uratsuka Isao C O Nitto Denko, Hosokawa Toshitsugu C O Nitto: Spot-weldable sheet adhesive.. Nitto Denko, March 28, 1990: EP0360214-A2 (20 worldwide citation)

Disclosed is a spot-weldable sheet adhesive comprising a composition containing an epoxy resin component, a hardening agent, a foaming agent and a needle electroconductive filler and optionally additionally containing a synthetic rubber component. The sheet adhesive has excellent adhesiveness, seali ...

Yamamoto Kazuhiko, Miyake Yuichi, Okada Chikara: Permanent magnet containing rare earth metal, boron and iron.. Santoku Metal, January 4, 1995: EP0632471-A2 (16 worldwide citation)

A permanent magnet is obtained by pulverizing, molding and sintering a starting material containing an alloy ingot. The alloy ingot contains not less than 90% by volume of prismatic crystals each having a prismatic crystal grain size of 0.1 to 50 mu m along a short axis thereof and a prismatic cryst ...


Yamamoto Kazuhiko, Asai Masayuki, Horii Sadayoshi, Ishihara Toshinobu, Kaneko Isao: Method of manufacturing semiconductor device. Matsushita Electric, Hitachi Kokusai Electric, Shin Etsu Chem, June 3, 2004: JP2004-158481 (14 worldwide citation)

PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which the deterioration of the electrical characteristic of a semiconductor device caused by fetched byproducts of reactions and the drop of the capacity of the device caused by the oxidation of the substrate can be p ...

Tanibuchi Yuji, Yamamoto Kazuhiko, Okada Chikara: Age-precipitating rare earth metal-nickel alloy, its manufacture, and negative electrode for nickel-hydrogen secondary cell. Santoku Metal, January 2, 1997: EP0751229-A1 (12 worldwide citation)

An AB5 type age-precipitating rare earth metal-nickel alloy having a composition expressed by (1): R(Ni1-xMx)5+y where R represents one or more of rare-earth elements including Y, M represents one or more selected from a group of Co, Al, Mn, Fe, Cu, Zr, Ti, Mo, W, and B and x and y respectively sati ...


Yamamoto Kazuhiko, Akata Yuzo: Semiconductor wafer-retaining protective hot-melt sheet and method for application thereof. Nitto Denko, February 8, 2000: JP2000-038556 (11 worldwide citation)

PROBLEM TO BE SOLVED: To obtain semiconductor wafer-retaining protective sheets capable of following up the projections and recesses in the surface of a wafer even if the difference among them is large. SOLUTION: A semiconductor wafer-retaining protective hot-melt sheet is a sheet for retaining and ...

Yamamoto Kazuhiko, Akada Yuzo: Hot-melt sheet for holding and protecting semiconductor wafers and method for applying the same. Nitto Denko, February 2, 2000: EP0977254-A2 (10 worldwide citation)

A sheet for holding and protecting semiconductor wafers which can closely follow up even a wafer surface having large roughness is disclosed. The hot-melt sheet for holding and protecting semiconductor is applied to a surface of a semiconductor wafer to thereby hold and protect the semiconductor waf ...


Hayashi Shigenori, Yamamoto Kazuhiko: Method for fabricating semiconductor device. Matsushita Electric, September 5, 2003: JP2003-249497 (9 worldwide citation)

PROBLEM TO BE SOLVED: To enhance the performance of an MOSFET by forming a gate insulation film only of a high permittivity material while preventing formation of an interface layer having a low permittivity on a substrate.SOLUTION: After a metal film 102 is deposited on a substrate 101 in a non-oxi ...

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