1
Yahya Haghiri Tehrani: Method for making an identification card having features for testing in incident and transmitted light. GAO Gesellschaft fur Automation und Organisation mbH, Stevens Davis Miller & Mosher, December 8, 1987: US04711690 (87 worldwide citation)

The multilayer identification card comprises several synthetic layers compounded by the effects of heat and pressure. An inside interface of at least one of these layers exhibits depressions which are filled with the material of the adjacent layer during the laminating process. The adjacent layers a ...


2
Yahya Haghiri Tehrani: Chip card and a method for producing it. GAO Gesellschaft Fur Automation und Organisation mbH, Bacon & Thomas, October 14, 1997: US05677524 (74 worldwide citation)

On a check card having a mini chip card disposed detachably in an adapted recess the mini chip card is fixed in position by at least one fastening element provided on the card surface. After a first punching operation in which the mini chip card is still connected with the card body by bridges the f ...


3
Joachim Hoppe, Yahya Haghiri Tehrani: Identification card with IC chip and a method for manufacturing the same. GAO Gesellschaft fur Automation und Organisation mbH, Neuman Williams Anderson & Olson, November 29, 1983: US04417413 (74 worldwide citation)

An identification card incorporating an integrated circuit (IC) chip for processing electric signals incorporates a separate supporting element for the IC chip. The supporting element is mounted in a window of one corner of the identification card to avoid the principal axis of stress. The chip supp ...


4
Yahya Haghiri Tehrani: Data carrier having an integrated circuit and a method for producing the same. GAO Gesellschaft fur Automation und Organisation mbH, Bacon & Thomas, January 30, 1990: US04897534 (64 worldwide citation)

The present invention relates to a data carrier having an integrated circuit and to a method for making the same. During production a carrier element equipped with an integrated circuit and contact surfaces is inserted into a recess in the data carrier blank. To allow for the carrier element to be f ...


5
Yahya Haghiri Tehrani, Joachim Hoppe: Identification card with an IC-module and method for producing it. GAO Gesellschaft fur Automation und Organisation mbH, Andrus Sceales Starke & Sawall, May 22, 1984: US04450024 (64 worldwide citation)

An identification card equipped with an integrated circuit, in which the circuit along with its connection leads is arranged on a carrier element which is embeddedly enclosed by the card on all sides by use of the hot lamination technique. In order to protect the sensitive arrangement, the carrier e ...


6
Joachim Hoppe, Yahya Haghiri Tehrani: Identification card having an IC module. Gao Gesellschaft fur Automation und Organisation mbH, Williams Anderson & Olson Neuman, August 7, 1984: US04463971 (63 worldwide citation)

An identification card or similar data carrier having an IC module for the processing of electrical signals, whereby the IC module along with its leads and contacts is arranged on a separate carrier element which is embedded in the card. An anchoring element is arranged in the area of the carrier el ...


7
Yahya Haghiri Tehrani, Joachim Hoppe: Data carrier having an integrated circuit and method for producing same. Bacon & Thomas, December 20, 1988: US04792843 (52 worldwide citation)

A multilayer data carrier into which a carrier element supporting an IC module is incorporated comprises a flexible substrate on which contact surfaces are formed which are connected to the IC module via leads. The carrier element is deformed in such a way, when being incorporated into the data carr ...


8
Yahya Haghiri Tehrani: Terminal arrangement for integrated circuit device. GAO Gesellschaft fur Automation und Organisation mbH, Bacon & Thomas, October 8, 1991: US05055913 (48 worldwide citation)

An integrated circuit includes electrically conductive terminals arranged to be connected to external leads for communication between the leads and the circuitry of the integrated circuit device. The terminals of the circuit device are disposed at a surface away from the perimeter of the integrated ...


9
Yahya Haghiri Tehrani, Renee Lucia Barak: Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame. GAO Gesellschaft fur Automation und Organisation mbH, Bacon & Thomas, April 19, 1994: US05304513 (47 worldwide citation)

A process for manufacturing a carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals ...


10
Joachim Hoppe, Yahya Haghiri Tehrani: Identification card having an IC module. Gao Gesellschaft fur Automation und Organisation, Sandler & Greenblum, July 29, 1986: US04603249 (47 worldwide citation)

A multilayer identification card is equipped with an IC module. The module is arranged on a carrier element which is located in a recess in the multilayer card. The card layers bordering the recess bear supporting layers which are thermoresistant in the range of hot lamination temperatures. This pre ...