1
Tsukamoto Takashi, Abe Sachiyuki, Yabushita Tetsuo, Hayashi Yoshimitsu C O Seiko E: Semiconductor device and semiconductor device packaging system.. Seiko Epson, May 27, 1992: EP0486829-A2 (23 worldwide citation)

A package (1) comprising a first semiconductor chip (100) with pads for wire bonding and contacts for chip-to-chip interconnection, and a second semiconductor chip (200) also with contacts for chip-to-chip interconnection is mounted on a substrate (4) with a printed circuit (6). The first and second ...


2
Yabushita Tetsuo: Semiconductor device and manufacture thereof. Seiko Epson, January 28, 1994: JP1994-021132

PURPOSE: To prevent the deterioration in reliability by providing a die post comprising non-insulating material on a die pad, connecting the die post to a bonding pad, and making the size of the die pad same as the size of the die pad of a semiconductor device without a ground bond. CONSTITUTION: A ...


3
Yabushita Tetsuo: Surface mounted semiconductor device. Seiko Epson, January 28, 1994: JP1994-021310

PURPOSE: To provide a semiconductor device of multipin while moreover being hard to cause a shortcircuit at the time of soldering in a surface mounting type semiconductor device. CONSTITUTION: In this surface mounted semiconductor device consisting of a semiconductor chip where a plurality of electr ...


4
Tsukamoto Takashi, Abe Sukeyuki, Yabushita Tetsuo, Hayashi Yoshimitsu: Program command word length variable type calculator and data processor. Seiko Epson, June 1, 1992: JP1992-158565

PURPOSE: To make it possible to constitute a new central processing device relatively easily by integrating a command resistor means, a command decoder means, and a timing generator means into a first semiconductor chip and the remaining control section and arithmetic and logic section into a second ...