Peter Michel, Willy Michel: Glucose measuring device. Disetronic Licensing, McAulay Fisher Nissen Goldberg & Kiel, December 9, 1997: US05695623 (592 worldwide citation)

The device for measuring and displaying the concentration of glucose in the blood comprises a display device (2) into which disposable sensors (1) comprising a biomembrane (9) can be inserted. The display device (2) comprises a built-in computer (3) in whose memory (7) a glucose concentration diagra ...

Fritz Kirchhofer, Willy Michel: Needle system fastening mechanism. Disetronic, Walter C Farley, March 18, 1997: US05611786 (27 worldwide citation)

A fastening mechanism for a needle system with the liquid system being a cartridge ampoule (4) and with a needle holder (3). The needle holder (3) is snapped onto the cartridge ampoule (4) or a cartridge ampoule holder containing the cartridge ampoule (4) by means of a snap-in closure means. The fas ...

Jasper Francis Emile, Peeters Josephus Bonifacius, Sierens Willy Michel: Wire bonding.. Prutec, June 13, 1984: EP0110635-A1 (5 worldwide citation)

The invention relates to a method of wire bonding in which the wire is coated with a polymerisable material which is cured by exposure to radiation after the wire bond has been formed. In this way the wire is insulated so as to enable a higher interconnection density without risk of short circuit. T ...

Peeters Joseph Bonifacius, Browne Edward Keith, Sierens Willy Michel, Jensen Borge Rils: Piezoresistive transducer.. Prutec, May 2, 1985: EP0139370-A1 (5 worldwide citation)

The invention relates to a transducer comprising a resistance bridge 10 having at least one arm 22, 26 formed by a piezoresistive element arranged on a flexible substrate of which at least the surface is not electrically conductive. A voltage is applied across one diagonal of the bridge 10 and an in ...

Willy Michel, Ulrich Haueter, Thomas Frei: Sensor system including a port body. Disetronic Licensing, Dorsey & Whitney, September 20, 2005: US06945955 (2 worldwide citation)

The invention provides a device and methods for analysing body fluids wherein the device is implanted in the body and provides for both the delivery of substances into the body and for the testing of body fluids.

Ludovic Ecarnot, Willy Michel, Patrick Reynaud, Walter Schwarzenbach: Method for fabricating a compound-material wafer. S O I Tec Silicon on Insulator Technologies, Winston & Strawn, February 22, 2011: US07892861 (2 worldwide citation)

The present invention provides improved methods for fabricating compound-material wafers, in particular a silicon on insulator type wafer. The improved methods lead to reduced numbers of deflects arising on or near the periphery of the wafers. In a first method, wafers are selected in dependence on ...

Kerdiles Sebastien, Willy Michel, Schwarzenbach Walter, Delprat Daniel: Amelioration de la qualite de linterface de collage par nettoyage froid et collage a chaud. Soitec Silicon On Insulator, August 22, 2008: FR2912839-A1 (2 worldwide citation)

L'invention propose un procédé de collage de deux substrats entre eux au cours duquel on procède à la mise en contact des surfaces desdits substrats, comprenant au moins une étape de nettoyage de la surface de l'un et/ou l'autre des substrats à coller avant la mise en contact de leurs surfaces, cara ...


Ullmann Jerzy Josef, Fry Richard, Raven Anthony, Sierens Willy Michel Desire: Method and apparatus for loading information into an integrated circuit semiconductor device. Pa Consulting Services, April 16, 1986: GB2165693-A (1 worldwide citation)

An arrangement for loading information into an integrated circuit semiconductor device (10) comprises a mask (14) having a plurality of regions which may be more transmissive or less transmissive to radiation (12), to form a state pattern. The device (10) may be a memory or an array of logic gates, ...

Sébastien Kerdiles, Willy Michel, Walter Schwarzenbach, Daniel Delprat, Nadia Ben Mohamed: Method of bonding two substrates. Soitec, Winston & Strawn, January 8, 2013: US08349703

The invention relates to a method of forming a structure comprising a thin layer of semiconductor material transferred from a donor substrate onto a second substrate, wherein two different atomic species are co-implanted under certain conditions into the donor substrate so as to create a weakened zo ...