1
Raymond A Fillion, William P Kornrumpf, Edward S Bernard: Hermetically packaged HDI electronic system. General Electric Company, Geoffrey H Krauss, May 24, 1994: US05315486 (90 worldwide citation)

A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a cofired body including buried conductors which provide electrical continuity between a set of inner co ...


2
John D Harnden Jr, William P Kornrumpf: LCD Hook-on digital ammeter. General Electric Company, Marvin Snyder, James C Davis Jr, December 17, 1985: US04559496 (88 worldwide citation)

A low cost hook-on ammeter for consumer use includes a split core to be clipped around a conductor. Secondary turns on the core actuate a liquid crystal digital display to indicate alternating current amplitude in the conductor. The liquid crystal display segments may be connected to individual taps ...


3
Charles W Eichelberger, William P Kornrumpf, Robert J Wojnarowski: Flexible high density interconnect structure and flexibly interconnected system. Martin Marietta Corporation, Marvin Snyder, Geoffrey H Krauss, September 19, 1995: US05452182 (84 worldwide citation)

A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary inte ...


4
William P Kornrumpf: Compact high density interconnected microwave system. General Electric Company, Robert Ochis, Geoffrey Krauss, September 6, 1994: US05345205 (75 worldwide citation)

A multimodule microwave system is assembled in a physically compact, high reliability manner employing a high density interconnect structure to interconnect the different modules of a microwave system by rendering the portion of the interconnect structure between modules flexible and by folding the ...


5
Robert J Wojnarowski, Charles W Eichelberger, William P Kornrumpf: High density interconnect structure including a chamber. General Electric Company, Geoffrey H Krauss, July 19, 1994: US05331203 (68 worldwide citation)

A high density interconnect structure is rendered suitable for the packaging of overlay sensitive chips by providing a cavity in the high density interconnect structure which spaces the sensitive surface of such chips from the overlying high density interconnect structure in a manner which prevents ...


6
William P Kornrumpf, Thomas M Jahns: Discharge lamp ballast with resonant starting. General Electric Company, Jack E Haken, Joseph T Cohen, Jerome C Squillaro, October 11, 1977: US04053813 (63 worldwide citation)

A circuit for operating an electric discharge lamp comprises an inductor in series with the lamp, a capacitor in parallel with the lamp, and a transistorized inverter circuit connected in series with the inductor and the lamp. The operating frequency of the inverter increases with increasing load. A ...


7
Kristina H V Hedengren, Richard O McCary, Robert P Alley, Richard J Charles, William P Kornrumpf, John D Young: Flexible eddy current surface measurement array for detecting near surface flaws in a conductive part. General Electric Company, Paul R Webb II, February 14, 1995: US05389876 (60 worldwide citation)

An eddy current probe array is disclosed comprising a plurality of spatially correlated eddy current probe elements sufficiently disposed within a flexible interconnecting structure to collect a discrete plurality of spatially correlated eddy current measurements for nondestructive near surface flaw ...


8
William P Kornrumpf, John D Harnden Jr: Piezoelectic relay module to be utilized in an appliance or the like. Pacific Bell, Fitch Even Tabin & Flannery, April 4, 1989: US04819126 (57 worldwide citation)

A piezoelectric relay module having a plurality of relays of different load ratings is disclosed. Each relay is constructed from a portion of a single bimorph structure by cutting the bimorph structure to form bimorph actuators. The widths of the various bimorph actuators is varied to provide the di ...


9
Kristina H V Hedengren, Richard J Charles, William P Kornrumpf: Apparatus for near surface nondestructive eddy current scanning of a conductive part using a multi-layer eddy current probe array. General Electric Company, Paul R Webb II, November 16, 1993: US05262722 (56 worldwide citation)

An apparatus for near surface, nondestructive eddy current scanning of a conductive part using a multi-layer eddy current probe array. Such structures of this type, generally, employ an ultra-thin, flexible, film-like, multi-layer eddy current probe array which is adapted to provide routine inspecti ...


10
John D Harnden Jr, William P Kornrumpf, James E Kohl, Michael S Adler: Piezoelectric switch. Pacific Bell, Fitch Even Tabin & Flannery, May 3, 1988: US04742263 (55 worldwide citation)

A switch is provided wherein a piezoelectric bimorph element is used to provide many separately controllable, closely spaced switchable contacts. The element includes at least two oppositely extending fingers connected by a common spine. The element spine is mounted to a case with the fingers spaced ...