1
Cheryl A Hoffman, Mark A Lavin, William Leipold, Kathleen McGroddy, Daniel J Nickel: Method and system using the design pattern of IC chips in the processing thereof. International Business Machines Corporation, Heslin & Rothenberg P C, September 3, 1996: US05552996 (24 worldwide citation)

The techniques of the present invention facilitate the control of an IC chip fabrication level of a fabrication process based upon the design pattern of the IC chip being fabricated. A grid having multiple sections is imposed over the design pattern of a fabrication level of the IC chip. Then, patte ...


2
Robert J Allen, John M Cohn, Peter A Habitz, William Leipold, Ivan Wemple, Paul S Zuchowski: IC tiling pattern method, IC so formed and analysis method. International Business Machines Corporation, Ira D Blecker, February 23, 2010: US07669159

The invention provides a method for providing an integrated circuit (6) having a substantially uniform density between parts (10, 12, 14 and 16) of the IC that are non-orthogonally angled. In particular, the invention provides fill tiling patterns (32, 34) oriented substantially parallel to electric ...


3
Robert J Allen, John M Cohn, Peter A Habitz, William Leipold, Ivan Wemple, Paul S Zuchowski: Ic tiling pattern method, ic so formed and analysis method. International Business Machines Corporation, International Business Machines Corporation, Dept 18g, December 8, 2005: US20050273744-A1

The invention provides a method for providing an integrated circuit (6) having a substantially uniform density between parts (10, 12, 14 and 16) of the IC that are non-orthogonally angled. In particular, the invention provides fill tiling patterns (32, 34) oriented substantially parallel to electric ...



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