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Klaus D Beyer, William L Guthrie, Stanley R Makarewicz, Eric Mendel, William J Patrick, Kathleen A Perry, William A Pliskin, Jacob Riseman, Paul M Schaible, Charles L Standley: Chem-mech polishing method for producing coplanar metal/insulator films on a substrate. International Business Machines Corporation, John A Stemwedel, July 31, 1990: US04944836 (327 worldwide citation)

A method is disclosed for producing coplanar metal/insulator films on a substrate according to a chem-mech polishing technique. In one example, a substrate having a patterned insulating layer of dielectric material thereon, is coated with a layer of metal. The substrate is then placed in a parallel ...


2
Manoocher Birang, Allan Gleason, William L Guthrie: Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus. Applied Materials, Fish & Richardson, April 13, 1999: US05893796 (320 worldwide citation)

The polishing pad for a chemical mechanical polishing apparatus and a method of making the same. The polishing pad has a covering lawyer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second ...


3
Melanie M Chow, John E Cronin, William L Guthrie, Carter W Kaanta, Barbara Luther, William J Patrick, Kathleen A Perry, Charles L Standley: Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias. International Business Machines Corporation, Robert J Haase, John A Stemwedel, December 6, 1988: US04789648 (313 worldwide citation)

Patterned conductive lines are formed simultaneously with stud via connections through an insulation layer to previously formed underlying patterned conductive lines in multilevel VLSI chip technology. A first planarized layer of insulation is deposited over a first level of patterned conductive mat ...


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William L Guthrie, Tsungnan Cheng, Sen Hou Ko, Harry Q Lee, Michael T Sherwood, Norm Shendon: Method and apparatus for using a retaining ring to control the edge effect. Applied Materials, Fish & Richardson P C, August 18, 1998: US05795215 (110 worldwide citation)

A process using a retaining ring assembly of a carrier head to precompress a polishing pad to reduce or minimize the edge effect in a chemical mechanical polishing process.


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Manoocher Birang, Allan Gleason, William L Guthrie: Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus. Applied Materials, Fish & Richardson, April 4, 2000: US06045439 (101 worldwide citation)

The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second ...


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Naftali E Lustig, Randall M Feenstra, William L Guthrie: In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage. International Business Machines Corporation, Michael J Balconi Lamica, August 9, 1994: US05337015 (95 worldwide citation)

An in-situ thickness monitoring/endpoint detection method and apparatus for chemical-mechanical polishing (CMP) of a dielectric layer on a top surface of a semiconductor wafer is disclosed. The apparatus comprises center and guard electrodes and associated electronic circuitry, including a high freq ...


8
Ming Fea Chow, William L Guthrie, Frank B Kaufman: Method of forming fine conductive lines, patterns and connectors. International Business Machines Corporation, Shirley Church Moore, October 27, 1987: US04702792 (80 worldwide citation)

The present invention discloses a method of forming fine conductive lines, patterns, and connectors, and is particularly useful in the formation of electronic devices. The method comprises a series of steps in which: a polymeric material is applied to a substrate; the polymeric material is patterned ...


9
Manoocher Birang, Allan Gleason, William L Guthrie: Method of forming a transparent window in a polishing pad. Applied Materials, Fish & Richardson, August 28, 2001: US06280290 (77 worldwide citation)

The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second ...


10
William L Guthrie, Semyon Spektor, Ivan A Ocanada, Norm Shendon: Apparatus and method for distribution of slurry in a chemical mechanical polishing system. Applied Materials, Fish & Richardson P C, January 20, 1998: US05709593 (63 worldwide citation)

Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly acros ...