1
David J Alcoe, William L Brodsky, Varaprasad V Calmidi, Sanjeev B Sathe, Randall J Stutzman: Thermally enhanced lid for multichip modules. International Business Machines Corporation, Arthur J Samodovitz, Schmeiser Olsen & Watts, December 16, 2003: US06665187 (42 worldwide citation)

An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matche ...


2
William L Brodsky, Thomas G Macek, John J Squires: Connector assembly including bilayered elastomeric member. International Business Machines Corporation, Lawrence R Fraley, October 22, 1991: US05059129 (38 worldwide citation)

An electrical connector assembly including a bilayered elastomeric element of integral construction for providing effective contact force (pressure) between corresponding arrays of conductors located on two circuit members (e.g., one a flexible circuit and the other a more rigid, circuit board or ca ...


3
William L Brodsky, James D Herard, Thomas G Macek, Timothy L Sharp, George J Shovlowsky: Circuitized structure including flexible circuit with elastomeric member bonded thereto. International Business Machines Corporation, Lawrence R Fraley, November 21, 1995: US05468917 (38 worldwide citation)

A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is uti ...


4
William L Brodsky, James D Herard: Portable external flexible cable and package using same. International Business Machines Corporation, Lawrence R Fraley, November 21, 1995: US05468159 (33 worldwide citation)

This invention provides a means of using flexible (also often referred to as simply "flex") circuit structures for external cabling in a small light package, particularly those utilized in portable computers. The external cabling is composed of a flex circuit that is strengthened by fiber strands, a ...


5
William L Brodsky, William E Buchler Jr, Benson Chan: Land grid array connector and method for forming the same. International Business Machines Corporation, Ronald A D&apos Alessandro, Hoffman Warnick & D&apos Alessandro, January 20, 2004: US06679707 (24 worldwide citation)

The present invention provides a land grid array (LGA) connector that is formed from a plurality of sections. Specifically, each LGA section includes at least one set of fingers. Each set of fingers interconnects with a set of fingers of another section to form the LGA connector. By forming the LGA ...


6
William L Brodsky, Wesley J Buyck, Alan D Knight: Electrical connector assembly including pressure exertion member. International Business Machines Corporation, Lawrence R Fraley, February 20, 1990: US04902234 (23 worldwide citation)

An electrical connector assembly for connecting two circuit members (e.g., printed circuit board, flexible cable) each including a plurality of electrical connectors thereon. The assembly includes a pressure exertion member having a substantially rigid (e.g., metallic) base plate, a plurality of com ...


7
William L Brodsky: Printed wiring board thickness control for compression connectors used in electronic packaging. International Business Machines Corporation, John A Jordan, Arthur J Samodovitz, June 1, 2004: US06743026 (18 worldwide citation)

The effect upon reliability of thickness variation in a printed wiring board at the LGA compression connection site of an electronic module is reduced. Plated through holes formed in a printed wiring board at the mounting site of an electronic module typically result in upper and lower opposing surf ...


8
David J Alcoe, William L Brodsky, David V Caletka: Electrical connector system with member having layers of different durometer elastomeric materials. International Business Machines Corporation, Lawrence R Fraley, February 23, 1999: US05873740 (11 worldwide citation)

An electrical connector assembly which utilizes a double layered elastomeric for a pressure exertion member wherein the two, individual layers are of different hardness. The first layer is of a relatively low durometer elastomeric material while the second layer is of higher durometer elastomeric ma ...


9
David J Alcoe, William L Brodsky, Varaprasad V Calmidi, Sanjeev B Sathe, Randall J Stutzman: Thermally enhanced lid for multichip modules. International Business Machines Corporation, Schmeiser Olsen & Watts, William H Steinberg, March 6, 2007: US07186590 (10 worldwide citation)

An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matche ...


10
William L Brodsky, Peter J Brofman, James A Busby, Bruce J Chamberlin, Scott A Cummings, David L Edwards, Thomas J Fleischman, Michael J Griffin IV, Sushumna Iruvanti, David C Long, Jennifer V Muncy, Robin A Susko: Thermal pillow. International Business Machines Corporation, DeLio & Peterson, Kelly M Nowak, Joseph Petrokaitis, May 4, 2010: US07709951 (10 worldwide citation)

Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on oppos ...