1
David B Noddin, Robin E Gorrell, William G Petefish, Kevin L Stumpe, Boydd Piper, Deepak N Swamy, Jimmy Leong, Michael R Leaf: Multilayer interconnect system for an area array interconnection using solid state diffusion. Supercomputer Systems Partnership, Patterson & Keough, January 11, 1994: US05276955 (56 worldwide citation)

A method and apparatus for manufacturing large area multilayer interconnects for electronic substrates and circuit boards uses high density area array interconnections that are created by solid state diffusion. Two or more pretested subsections are electrically and mechanically joined together to si ...


2
Donald R Banks, Ronald G Pofahl, Mark F Sylvester, William G Petefish, Paul J Fischer: Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate. Gore Enterprise Holdings, Victor M Genco Jr, January 18, 2000: US06015722 (56 worldwide citation)

The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integ ...


3
Mark F Sylvester, David A Hanson, William G Petefish: Interconnect module with reduced power distribution impedance. 3M Innovative Properties Company, Melanie G Gover, January 25, 2005: US06847527 (45 worldwide citation)

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated cir ...


4
Paul J Fischer, William G Petefish: Integrated circuit package. W L Gore & Associates, Victor M Genco Jr, June 11, 1996: US05525834 (41 worldwide citation)

An integrated circuit package for housing an integrated circuit (IC) chip and providing electrical connectivity of data signals and voltage signals between the IC chip and an electronic component includes a substrate, an IC chip affixed to the substrate and at least three conductive layers on the su ...


5
Donald R Banks, Ronald G Pofahl, Mark F Sylvester, William G Petefish, Paul J Fischer: Method for assembling an integrated circuit chip package having at least one semiconductor device. Gore Enterprise Holdings, Victor M Genco Jr, July 6, 1999: US05919329 (38 worldwide citation)

The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integ ...


6
Donald R Banks, Ronald G Pofahl, Mark F Sylvester, William G Petefish, Paul J Fischer: Method for assembling an integrated circuit chip package having at least one semiconductor device. Gore Enterprise Holdings, Victor M Genco Jr, October 19, 1999: US05970319 (14 worldwide citation)

The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integ ...


7
Mark F Sylvester, David A Hanson, William G Petefish: Interconnect module with reduced power distribution impedance. January 22, 2004: US20040012938-A1 (1 worldwide citation)

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated cir ...


8
Mark F Sylvester, David A Hanson, William G Petefish: Interconnect module with reduced power distribution impedance. September 2, 2004: US20040170006-A9

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated cir ...