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William F Thiessen: Temperature compensated vertical pin probing device. Wentworth Laboratories, Wiggin and Dana, Anthony P Gangemi, Gregory S Rosenblatt, August 9, 2005: US06927586 (64 worldwide citation)

An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of a metal alloy, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer of adhesive. The spacers may be composed of foils adhered to one another in a lamina ...


2
William F Thiessen, Francis T McQuade: Temperature compensated vertical pin probing device. Wentworth Laboratories, William C Crutcher, October 2, 2001: US06297657 (42 worldwide citation)

An improved vertical pin probing device is constructed using Invar, which substantially matches the coefficient of thermal expansion of the silicon wafer being probed. Spaced dies with Invar foils supporting the probe pins are coated with wear-resistant dielectric materials having lubricity to permi ...


3
Francis T McQuade, Zbigniew Kukielka, William F Thiessen, Stephen Evans: Nickel alloy probe card frame laminate. Wentworth Laboratories, Gregory S Rosenblatt, Wiggin & Dana, December 9, 2003: US06661244 (15 worldwide citation)

A probe head assembly for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer portion formed from a plurality of laminated metallic layers. The laminated metallic layers are formed from a low coefficient of thermal expansion met ...


4
William F Thiessen, Arthur Evans: Temperature compensated vertical pin probing device. Wentworth Laboratories, William C Crutcher, December 19, 2000: US06163162 (9 worldwide citation)

An improved vertical pin probing device is constructed with a housing spaced upper and lower dies of Invar.RTM., which substantially matches the coefficient of thermal expansion of the silicon wafer being probed. Spaced slots in the top and bottom dies of the housing contain inserts of Vespel.RTM.. ...


5
William H Fulton, William F Thiessen: Probe pin cleaning system. Wentworth Laboratories, Wiggin and Dana, Anthony P Gangemi, Gregory S Rosenblatt, July 1, 2008: US07392563

An improved device for cleaning probe pins of a probe head assembly is presented. The device includes a first holding plate, a second holding plate and a cleaning cartridge. The first holding plate secures the probe head assembly. The second holding plate secures the cleaning cartridge in proximity ...


6
William H Fulton, William F Thiessen: Probe pin cleaning system and method. Wentworth Laboratories, Wiggin And Dana, July 15, 2004: US20040134516-A1

An improved device for cleaning probe pins of a probe head assembly is presented. The device includes a first holding plate, a second holding plate and a cleaning cartridge. The first holding plate secures the probe head assembly. The second holding plate secures the cleaning cartridge in proximity ...


7
William F Thiessen: Temperature compensated vertical pin probing device. Wentworth Laboratories, Wiggin & Dana, March 18, 2004: US20040051546-A1

An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of Invar®, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer of adhesive. The Invar spacers may be composed of Invar foils adhered to one another in a l ...


8
Francis T McQuade, Zbigniew Kukielka, William F Thiessen, Stephen Evans: Nickel alloy probe card frame laminate. Wiggin & Dana, August 7, 2003: US20030146769-A1

A probe head assembly for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer portion formed from a plurality of laminated metallic layers. The laminated metallic layers are formed from a low coefficient of thermal expansion met ...


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