1
Richard P Pashby, Douglas W Phelps Jr, Sigvart J Samuelsen, William C Ward: Package semiconductor chip. International Business Machines Corporation, Francis J Thornton, Theodore E Galanthay, Michael J Weins, August 29, 1989: US04862245 (453 worldwide citation)

The present invention is directed to a packaged semiconductor chip which effectively dissipates heat and has improved performance. The packaged chip has a plurality of lead frame conductors extending through the encapsulating material which are adhesively joined to the semiconductor chip, preferably ...


2
Roger C Kershaw, Frank J Romano, Leonard C Swanson, William C Ward Jr: System and methods for computer based testing. Educational Testing Service, Woodcock Washburn Kurtz Mackiewicz & Norris, October 27, 1998: US05827070 (145 worldwide citation)

The present invention provides a system and method for computer based testing. The system of the present invention comprises a test development system for producing a computerized test, a test delivery system for delivering the computerized test to an examinee, and a workstation on which the compute ...


3
Roger C Kershaw, Frank J Romano, Leonard C Swanson, William C Ward Jr: System and method for computer based testing. Educational Testing Service, Woodcock Washburn Kurtz Mackiewicz & Norris, October 15, 1996: US05565316 (126 worldwide citation)

The present invention provides a system and method for computer based testing. The system of the present invention comprises a test development system for producing a computerized test, a test delivery system for delivering the computerized test to an examinee, and a workstation on which the compute ...


4
Douglas W Phelps Jr, Robert J Redmond, William C Ward: Peripheral/area wire bonding technique. International Business Machines Corporation, Sughrue Mion Zinn Macpeak and Seas, January 3, 1989: US04796078 (121 worldwide citation)

An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the firs ...


5
H Ward Conru, Gary H Irish, Francis J Pakulski, William J Slattery, Stephen G Starr, William C Ward: Method of making a planarized thin film covered wire bonded semiconductor package. International Business Machines Corporation, Francis J Thornton, February 4, 1992: US05086018 (94 worldwide citation)

A method of making a semiconductor chip in which the conductive path between the chip and the lead frame via wires can be easily and reproduceably improved. This is accomplished by improving the bond between the wires and the lead frame members to which the wires are joined and by creating additiona ...


6
Robert Marks, Douglas W Phelps Jr, William C Ward: Substrate with multiple type connections. International Business Machines Corporation, George Tacticos, Theodore E Galanthay, William N Hogg, May 8, 1984: US04447857 (65 worldwide citation)

A novel substrate is disclosed which can mount either flip-chip solder bonded IC chips or wire bonded chips, or both chips, or a single chip having both solder bonds and wire bonds is disclosed. The substrate has an array of solder pads which will accept solder bonds. Those pads which are to be used ...


7
Friedrich A Karner, Douglas W Phelps Jr, Stephen G Starr, William C Ward: Semiconductor package with ground plane. International Business Machines Corporation, Francis J Thornton, October 23, 1990: US04965654 (58 worldwide citation)

A plastic encapsulated semiconductor package in which the connecting lead frame members are deposited over the surface of the device together with a covering ground plane so as to provide enhanced electrical and thermal coupling of the members and the device and so reduce the signal to noise ratio b ...


8
H Ward Conru, Gary H Irish, Francis J Pakulski, William J Slattery, Stephen G Starr, William C Ward: Planarized thin film surface covered wire bonded semiconductor package. International Business Machines Corporation, Francis J Thornton, September 29, 1992: US05151559 (49 worldwide citation)

This is a semiconductor chip in which the conductive path between the chip and the lead frame via wires can be easily and reproduceably improved. This is accomplished by improving the bond between the wires and the lead frame members to which the wires are joined and by creating additional contacts ...


9
William C Ward: Semiconductor package. International Business Machines Corporation, Francis J Thornton, April 10, 1990: US04916519 (45 worldwide citation)

In an encapsulated semiconductor module in which a semiconductor chip, having a major surface with terminals thereon, is deposed within the encapsulating material, a plurality of self-supporting, unitary, discrete, and continuous lead frame conductors formed of metal sheet stock are positioned at va ...


10
William C Ward Jr: Novel carbamate additives for functional fluids. The Lubrizol, Forrest L Collins, Robert A Franks, Joseph L Fischer, July 11, 1989: US04846983 (38 worldwide citation)

Novel molybdenum or tungsten thiocarbamate additives for functional fluids, e.g., lubricating oils, automatic transmission fluids (ATF), as well as fuel compositions, have been developed. The molybdenum or tungsten carbamate compositions, compounds, complexes and oligomers of the present invention a ...