1
Erwin Meinders
Erwin Rinaldo Meinders, Maria Peter, Peter Theodorus Maria Giesen, Wilhelmus Johannes Maria de Laat: System for patterning flexible foils. Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO, Maryellen Feehery Hank, Reed Smith, October 29, 2013: US08570491

According to one aspect, the invention provides a table for compensating deformation in flexible foils (1) The table comprises a supportive base (2) and a deformation compensation system (3). This system comprises a plurality of movable elements (4), supported by the base (2), wherein the movable el ...


2
Erwin Meinders
Wilhelmus Johannes Maria De Laat, Cheng Qun Gui, Peter Theodorus Maria Giesen, Paulus Wilhelmus Leonardus Van Dijk, Erwin Rinaldo Meinders, Maria Peter: Lithographic method and carrier substrate. ASML Netherlands, Pillsbury Winthrop Shaw Pittman, October 4, 2011: US08029973

A carrier substrate is provided with a layer of PDMS and curing agent on one side of the carrier substrate. The PDMS and curing agent can be arranged to receive and adhere to a lithographic substrate. The carrier substrate can be dimensioned such that the combined carrier substrate and lithographic ...


3
Erwin Meinders
Wilhelmus Johannes Maria De Laat, Cheng Qun Gui, Peter Theodorus Maria Giesen, Marcus Theodoor Wilhelmus Van Der Heijden, Erwin Rinaldo Meinders, Mária Péter: Lithographic apparatus and method. Tno, ASML Netherlands, November 8, 2012: US20120281192-A1

A method of obtaining information indicative of the topography of a surface of a flexible substrate, the method including directing a beam of radiation at the surface of the flexible substrate; and detecting changes in intensity distribution, or angle of reflection, of the beam of radiation after th ...


4
Erwin Meinders
Wilhelmus Johannes Maria DE LAAT, Cheng Qun GUI, Peter Theodorus Maria GIESEN, Paulus Wilhelmus Leonardus VAN DIJK, Erwin Rinaldo MEINDERS, Maria PETER: Lithographic method and carrier substrate. Asml Netherlands, Pillsbury Winthrop Shaw Pittman, July 2, 2009: US20090170025-A1

A carrier substrate is provided with a layer of PDMS and curing agent on one side of the carrier substrate. The PDMS and curing agent can be arranged to receive and adhere to a lithographic substrate. The carrier substrate can be dimensioned such that the combined carrier substrate and lithographic ...


5
Michael Josephus Evert Van De Moosdijk, Klaus Simon, Wilhelmus Johannes Maria De Laat: Lithographic apparatus and device manufacturing method. ASML Netherlands, Pillsbury Winthrop Shaw Pittman, August 5, 2008: US07408624 (3 worldwide citation)

A lithographic apparatus includes a substrate table constructed to hold a first substrate of a first type, the first substrate having a polished surface; and a projection system configured to project a patterned radiation beam onto a target portion of a substrate. The polished surface supports a sec ...


6
Wilhelmus Johannes Maria De Laat, Cheng Qun Gui, Peter Theodorus Maria Giesen, Marcus Theodoor Wilhelmus Van Der Heijden, Erwin Rinaldo Meinders, Mária Péter: Lithographic apparatus and method. ASML NETHERLANDS, Pillsbury Winthrop Shaw Pittman, July 5, 2016: US09383195

A method of obtaining information indicative of the topography of a surface of a flexible substrate, the method including directing a beam of radiation at the surface of the flexible substrate; and detecting changes in intensity distribution, or angle of reflection, of the beam of radiation after th ...


7
Michael Josephus Evert Van De Moosdijk, Klaus Simon, Wilhelmus Johannes Maria De Laat: Lithographic apparatus and device manufacturing method. Asml Netherlands, Pillsbury Winthrop Shaw Pittman, January 4, 2007: US20070002303-A1

A lithographic apparatus includes a substrate table constructed to hold a first substrate of a first type, the first substrate having a polished surface; and a projection system configured to project a patterned radiation beam onto a target portion of a substrate. The polished surface supports a sec ...


8
Keith Frank Best, Cheng Qun Gui, Budiman Sutedja, Wilhelmus Johannes Maria De Laat: Measuring the bonding of bonded substrates. ASML Netherlands, Pillsbury Winthrop Shaw Pittman, April 10, 2008: US20080083818-A1

A method of measuring bonding quality of a bonded substrate having an upper substrate on top of a lower substrate, the method comprising etching one or more windows in the upper substrate such that overlay measurement alignment marks on the upper substrate may be seen by a measurement system and ove ...