1
Bahgat Sammakia, Wayne E Jones Jr, Ganesh Subbarayan: Nano-structure enhancements for anisotropic conductive adhesive and thermal interposers. The Research Foundation of the State University of New York, Hoffberg & Associates, January 12, 2010: US07645512 (7 worldwide citation)

The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesi ...


2
Bahgat Sammakia, Wayne E Jones Jr, Ganesh Subbarayan: Nano-structure enhancements for anisotropic conductive material and thermal interposers. The Research Foundation of State University of New York, Steven M Hoffberg, Ostrolenk Faber, August 27, 2013: US08518304 (3 worldwide citation)

The present invention features additions of nanostructures to interconnect conductor particles to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nanostructures at their surfaces; (2) improve the anisotropic conductive adhesive interconnectio ...


3
William E Bernier, Megan Fegley, Bradley Galusha, Francis D Goroleski, Wayne E Jones Jr, Kenneth H Skorenko: Increased thermal stabilization of optical absorbers. The Research Foundation for the State University of New York, Steven M Hoffberg, Tully Rinckey PLLC, March 13, 2018: US09915757

Compositions for increasing the thermal stability of optical absorbers are provided as well as methods of making and using the resulting compositions. The compositions or complexes of the present teachings generally include an optical absorber bound to a metal or a metal oxide through one or more li ...


4
William E Bernier, Nicholas A Ravvin, Wayne E Jones Jr, Kenneth H Skorenko: Conductive films and devices comprised thereof. The Research Foundation of State University of New York, Paul Frank Collins P C, March 20, 2018: US09920220

Embodiments of films and material layers comprising PEDOT. These embodiments are the result of methods that utilize polymerization processes including vapor phase polymerization (VPP) to form the conductive film comprising PEDOT. In one embodiment, the film can result from a method that includes ste ...