11
Warren M Farnworth, Salman Akram, Alan G Wood: Method for forming contact pins for semiconductor dice and interconnects. Micron Technology, Stephen A Gratton, March 5, 1996: US05495667 (273 worldwide citation)

A method for forming contact pins adapted to form an electrical connection with a mating contact location is provided. In a first embodiment, the contact pins are formed on an interconnect used for testing a semiconductor die and are adapted to establish an electrical connection with the bond pads o ...


12
Salman Akram, Warren M Farnworth, Alan G Wood: Method for fabricating semiconductor components using focused laser beam. Micron Technology, Stephen A Graton, September 5, 2000: US06114240 (270 worldwide citation)

A method for fabricating semiconductor components, such as packages, interconnects and test carriers, is provided. The method includes laser machining conductive vias for interconnecting contacts on the component, using a laser beam that is focused to produce a desired via geometry. The vias can inc ...


13
Salman Akram, Warren M Farnworth: Integrated circuit package and method of fabrication. Micron Technology, Dickstein Shapiro Morin & Oshinsky, February 22, 2000: US06028365 (256 worldwide citation)

The present invention is directed to a semiconductor package and its method of manufacture. Conductors mounted on a flexible polymer tape are used to connect a semiconductor chip to a substrate. The flexible polymer tape can be folded back under the chip to reduce the size necessary for mounting the ...


14
Salman Akram, David R Hembree, Warren M Farnworth: Micromachined chip scale package. Micron Technology, Task Britt & Rossa, June 6, 2000: US06072236 (245 worldwide citation)

A chip scale package comprised of a semiconductor die having a silicon blank laminated to its active surface. The bond pads of the die are accessed through apertures micromachined through the blank. The package may be employed with wire bonds, or solder or other conductive bumps may be placed in the ...


15
Alan G Wood, Warren M Farnworth: Process for packaging a semiconductor die using dicing and testing. Micron Technology, Stephen A Gratton, December 22, 1998: US05851845 (230 worldwide citation)

A method for packaging semiconductor dice is provided. The package includes a thinned die mounted on a compliant adhesive layer to a substrate. The package is formed by providing a wafer containing a plurality of dice, thinning a backside of the wafer by etching or polishing, attaching the thinned w ...


16
Salman Akram, Warren M Farnworth, Alan G Wood: Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice. Micron Technology, Stephen A Gratton, January 16, 1996: US05483741 (222 worldwide citation)

A method for forming a self-limiting, silicon based interconnect for making temporary electrical contact with bond pads on a semiconductor die is provided. The interconnect includes a silicon substrate having an array of contact members adapted to contact the bond pads on the die for test purposes ( ...


17
Warren M Farnworth, Alan G Wood: Semiconductor devices having interconnections using standardized bonding locations and methods of designing. Micron Technology, Trask Britt, January 2, 2001: US06169329 (214 worldwide citation)

A process for making a semiconductor device and the resulting device having standardized die-to-substrate bonding locations are herein disclosed. The semiconductor die provides a standardized ball grid or other array of a particular size, pitch and pattern such that as the size, configuration or bon ...


18
Warren M Farnworth, Alan G Wood, Trung Tri Doan: Method for fabricating encapsulated semiconductor components. Micron Technology, Stephen A Gratton, June 21, 2005: US06908784 (213 worldwide citation)

A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabrica ...


19
Warren M Farnworth: Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe. Micron Technology, Angus C Fox III, Stanley N Protigal, April 30, 1991: US05012323 (209 worldwide citation)

A semiconductor package incorporating a pair of semiconductor dice on a single leadframe of the type having a wire-bonding region at each end of a die-attachment region which has both an upper and lower surface. The first of said pair of dice is back bonded to the upper surface of said die-attachmen ...


20
Salman Akram, Warren M Farnworth, Alan G Wood: Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die. Micron Technology, Stephen A Gratton, November 11, 1997: US05686317 (190 worldwide citation)

A method for forming an interconnect for establishing a temporary electrical connection with contact locations (e.g., bond pads) on a semiconductor die is provided. The interconnect includes a substrate (e.g., silicon) having raised contact members that correspond to the contact locations on the die ...