1
Walter M Marcinkiewicz, Charles W Eichelberger, Robert J Wojnarowski: Compact high density interconnect structure. General Electric Company, Marvin Snyder, August 31, 1993: US05241456 (295 worldwide citation)

An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness to the thickness of the semiconductor chips plus the combined thickn ...


2
James D MacDonald Jr, Gerard James Hayes, John Michael Spall, Walter M Marcinkiewicz: Termination contact for an antenna with a nickel-titanium radiating element. Telefonaktiebolaget LM Ericsson, Burns Doane Swecker & Mathis L, April 4, 2000: US06046708 (136 worldwide citation)

A termination contact for an antenna that has a Ni--Ti radiating element is formed by a layer of electrically conductive carbon filler disposed on the Ni--Ti radiating element. A conductive element is positioned on the layer of conductive carbon filler to provide electrical interface between the Ni- ...


3
Walter M Marcinkiewicz, Raymond A Fillion, Barry S Whitmore, Robert J Wojnarowski: Integrated circuit chip placement in a high density interconnect structure. Martin Marietta Corporation, Geoffrey H Krauss, June 6, 1995: US05422513 (96 worldwide citation)

A high density interconnect (HDI) structure having a dielectric multi-layer interconnect structure on a substrate is fabricated by forming a chip well, placing a chip in the well, and connecting the chip to the interconnect structure. Additionally, temperature sensitive chips or devices may be locat ...


4
James D MacDonald Jr, Walter M Marcinkiewicz: Gel structure for combined EMI shielding and thermal control of microelectronic assemblies. Ericsson, Wood Phillips VanSanten Clark & Mortimer, February 27, 2001: US06195267 (82 worldwide citation)

A shielding and thermal dissipation structure for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. A plastic housing overlays the at least one electronic component, and includes an outer periphery defining ...


5
Walter M Marcinkiewicz: Integrated circuit module and method. Ericsson, Wood Phillips VanSanten Clark & Mortimer, February 15, 2000: US06025995 (72 worldwide citation)

An integrated circuit module is provided having a substrate, an integrated circuit on the substrate and defining an active surface remote from the substrate, and a die attached to the active surface of the integrated circuit. A layer of non-conductive material conformally coats the die and active su ...


6
Walter M Marcinkiewicz: Methods for packaging integrated circuit devices including cavities adjacent active regions. Ericsson, Myers Bigel Sibley & Sajovec, December 14, 1999: US06001673 (34 worldwide citation)

A method for packaging an integrated circuit device includes forming a dielectric support layer on the surface of a substrate wherein the dielectric support layer includes an opening therein exposing at least a portion of an active region of the substrate. A protective layer is provided on the diele ...


7
James D MacDonald Jr, Walter M Marcinkiewicz, Rahul Gupta: Method and apparatus for packaging a microelectronic device with an elastomer gel. Ericsson, Wood Phillips VanSanten Clark & Mortimer, May 18, 1999: US05905638 (19 worldwide citation)

An apparatus and method for packaging a microelectronic device to be connectable to a distribution circuit. The apparatus is in the form of a microelectronic package including a microelectronic device having first and second oppositely facing surfaces and a plurality of Input/Output pads on the firs ...


8
James D MacDonald Jr, Walter M Marcinkiewicz, Rahul Gupta: Shock and vibration attenuating structure for an electronic assembly. Ericsson, Wood Phillips VanSanten Clark & Mortimer, June 22, 1999: US05914864 (13 worldwide citation)

A shock and vibration attenuating structure and method is provided for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. The shock and vibration attenuating structure includes a layer of elastomer material ...


9
William P Kornrumpf, Walter M Marcinkiewicz, William E Davern, Herbert C Zieger, Jonathan R Miles: Compact, thermally efficient focal plane array and testing and repair thereof. General Electric Company, Marvin Snyder, James C Davis Jr, September 8, 1992: US05146303 (12 worldwide citation)

In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is ...


10
William P Kornrumpf, Walter M Marcinkiewicz, William E Davern, Herbert C Ziegler, Jonathan R Miles: Compact, thermally efficient focal plane array and testing and repair thereof. General Electric Company, Marvin Snyder, October 20, 1992: US05157255 (11 worldwide citation)

In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is ...