1
David J Corisis, Jerry M Brooks, Walter L Moden: Stackable ball grid array package. Micron Technology, Trask Britt & Rossa, June 6, 2000: US06072233 (304 worldwide citation)

A stackable fine ball grid array (FBGA) package is disclosed that allows the stacking of one array upon another. This stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive ele ...


2
Jerrold L King, Walter L Moden, Chender Huang: Method for producing high speed integrated circuits. Micron Technology, Wayne E Duffy, June 1, 1993: US05214845 (289 worldwide citation)

This invention creates a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or adjacent to a flexible ground circuit and a flexible power circuit. The signal, power and ground circuits a ...


3
Walter L Moden, David J Corisis, Leonard E Mess, Larry D Kinsman: Stackable ceramic FBGA for high thermal applications. Micron Technology, TraskBritt, October 2, 2001: US06297548 (187 worldwide citation)

An apparatus package for high temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.


4
Robert E Iverson, Walter L Moden: Tie bar over chip lead frame design. Micron Technology, Kevin D Martin, July 23, 1996: US05539251 (175 worldwide citation)

A "leads over chip" lead frame design is disclosed which can be used with a conventional die having leads located at the periphery. The inventive design uses an elongated tie bar which extends from one side of the lead frame to the other, across the die. The die is attached to the bottom of the tie ...


5
Leonard E Mess, David J Corisis, Walter L Moden, Larry D Kinsman: Apparatus and methods of packaging and testing die. Micron Technology, Dorsey & Whitney, September 25, 2001: US06294839 (173 worldwide citation)

Apparatus and methods of packaging and testing die. In one embodiment, a stacked die package includes a packaging substrate having a first surface with a recess disposed therein and a plurality of conductive leads coupled thereto, a first die attached to the packaging substrate within the recess and ...


6
Walter L Moden, Jerrold L King, Jerry M Brooks: Low profile multi-IC chip package connector. Micron Technology, Trask Britt, July 10, 2001: US06258623 (170 worldwide citation)

A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with busses forme ...


7
Walter L Moden, Jerrold L King, Jerry M Brooks: Low profile multi-IC chip package connector. Micron Technology, TraskBritt, May 1, 2001: US06225689 (145 worldwide citation)

A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed ...


8
Warren M Farnworth, Rockwell D Smith, Walter L Moden: Dissimilar adhesive die attach for semiconductor devices. Micron Technology, Stanley N Protigal, Kevin D Martin, April 19, 1994: US05304842 (139 worldwide citation)

A semiconductor assembly comprises a semiconductor die which is attached by a carrier material to a lead frame. The carrier material is coated on the die side with one type of adhesive and on the lead frame side with a different adhesive. The lead frame has a small surface area to connect to the car ...


9
Walter L Moden: Flip chip adaptor package for bare die. Micron Technology, TraskBritt, July 24, 2001: US06265766 (137 worldwide citation)

A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as mi ...


10
Rich Fogal, Jerrold L King, Walter L Moden: Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape. Micron Technology, Stanley N Protigal, August 18, 1992: US05140404 (102 worldwide citation)

The invention described is directed to a packaged semiconductor chip. As detailed, the invention requires a reduced number of steps to attach a die to a lead frame. The invention uses a carrier material layered on one or two sides with thermoplastic which can be softened to a desired state by the ap ...



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