1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett Jr, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, July 20, 2004: US06765800 (46 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett Jr, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, Hunton & Williams, May 24, 2005: US06898085 (37 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple Channel Modules and Bus Systems Using Same. Rambus, Hunton & Williams Rambus, May 31, 2007: US20070120575-A1

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, Ross D Snyder & Associates, December 20, 2001: US20010053069-A1

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, Hunton & Williams Rambus, June 30, 2005: US20050142950-A1

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, Thomas E Anderson, Hunton & Williams, June 3, 2004: US20040105240-A1

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


7
Istvan Novak, Wai Yeung Yip: Method for edge termination of parallel conductive planes including estimating the characteristic impedance of the structure. Sun Microsystems, B Noel Kivlin, Conley Rose & Tayon PC, April 10, 2001: US06215373 (32 worldwide citation)

A system and method are presented for stabilizing the electrical impedance of a structure (e.g., an electrical interconnecting apparatus) including a pair of parallel planar conductors separated by a dielectric layer. The structure may be, for example, a PCB, a component of a semiconductor device pa ...


8
Wai Yeung Yip, Arijit Chandra, Chi Taou Tsai: Method for automatic tab artwork building. Motorola, Bernard Berman, November 7, 1995: US05465217 (18 worldwide citation)

A method for automated artwork building which comprises determining a desired die pad pitch, assigning inner lead bonding positions for each lead based on the average die pitch. The desired outer lead bonding position is then determined for each lead. The allowable range of fan in and fan out angles ...


9
Chi Taou Tsai, Wai Yeung Yip: Limiting parasitic signal coupling between conductors. Motorola, Joe E Barbee, Robert F Hightower, September 7, 1993: US05243547 (17 worldwide citation)

A plurality of conductors (10, 11, 12, 15) are formed into sections (13, 14, 16, 17, 18, 19) having uniform cross-sectional area. Per unit electrical parameters are developed for each section (13, 14, 16, 17, 18, 19). A conductor of the plurality of conductors (10, 11, 12, 15) is partitioned into a ...


10
Wai Yeung Yip, Arijit Chandra: Method for electrically modeling a semiconductor package. Motorola, Robert D Atkins, December 2, 1997: US05694344 (9 worldwide citation)

A method of electrically modeling a semiconductor package is provided. The method reduces computation time for mutual inductance calculations between interconnect lines of the semiconductor package. Only interconnect within a predetermined distance of an interconnect line being modeled is calculated ...