1
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with orthogonal windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, August 28, 2012: US08254155 (45 worldwide citation)

A microelectronic assembly can include first and second microelectronic packages mounted to opposed surfaces of a circuit panel. Each package can include a substrate having first, second, and third apertures extending therethrough, first, second, and third microelectronic elements each having a surf ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed: Multiple die face-down stacking for two or more die. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 25, 2012: US08338963 (44 worldwide citation)

A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned w ...


3
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with parallel windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, January 1, 2013: US08345441 (44 worldwide citation)

A microelectronic assembly can include first and second microelectronic packages mounted to respective first and second opposed surfaces of a circuit panel. Each microelectronic package can include a substrate having first and second apertures extending between first and second surfaces thereof, fir ...


4
Belgacem Haba Belgacem (Bel) Haba
Kishor Desai, Belgacem Haba, Wael Zohni: Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 19, 2013: US08378478 (42 worldwide citation)

The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelec ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed: Memory module in a package. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, August 20, 2013: US08513817 (41 worldwide citation)

A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the sub ...


6
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of signal terminals. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, March 11, 2014: US08670261 (34 worldwide citation)

A microelectronic structure has active elements defining a storage array, and address inputs for receipt of address information specifying locations within the storage array. The structure has a first surface and can have terminals exposed at the first surface. The terminals may include first termin ...


7
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Belgacem Haba, Wael Zohni: De-skewed multi-die packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 6, 2013: US08502390 (34 worldwide citation)

A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connecti ...


8
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, May 7, 2013: US08436477 (34 worldwide citation)

A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The microelectronic element c ...


9
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with parallel windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, May 14, 2013: US08441111 (30 worldwide citation)

A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of termina ...


10
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with parallel windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, May 7, 2013: US08436457 (30 worldwide citation)

A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of termina ...